Featured Report Analysis
ULTRALOQ Announces Aliro Certification for Smart Locks
ULTRALOQ smart locks achieved Aliro 1.0 certification, enabling standardized communication for consistent smart access across device ecosystems.
Analysis: Beijing Auto Show 2026 - Electric Vehicle and Technology Developments
The report highlights Beijing Auto China 2026, showcasing EV innovation, key premieres, and evolving strategies across electrification, intelligence, and supply chains.
2026 Beijing Auto Show: Is xHeart China’s Strategic Alternative to NVIDIA in Autonomous Driving?
SAIC showcased the MG 07 ahead of Beijing Auto Show 2026, emphasizing EV design and a Momenta‑enabled autonomous driving platform.
A2B: Low-Latency and Bandwidth Requirements Increased for Automotive Advanced Audio
SAIC previewed the MG 07 ahead of Beijing Auto Show 2026, featuring electric powertrains and a Momenta‑powered autonomous driving system.
CPL Biweekly Update – Circuit Protection and Connectors
Semiconductor sales surge 67% in 2026, driven by AI and datacenter demand, with the market nearing $1.42T on strong memory and logic growth.
RoboSense EM4/E1 vs. Sony Automotive LiDAR Sensors
This feature report compares RoboSense EM4 and E1 LiDAR, highlighting ultra‑long range, wide FOV, and SPAD d‑ToF structural design features.
OmniVision OS12A10 Exploratory Analysis
OmniVision OS12A10 is a 12 MP back‑illuminated CIS with 2.0 µm pixels, designed for IoT and home security, used in Ring Video Doorbell Pro (3rd Gen).
Samsung Exynos 2600 (2nm SF2) Transistor Characterization
TCR details NMOS and PMOS characteristics on Samsung’s 2 nm SF2 GAA die, profiling key electrical metrics for high‑performance core transistors.
Baidu Kunlunxin P800 AI Accelerator Processor Floorplan Analysis
Digital floorplan analysis examines Baidu Kunlunxin P800 AI accelerator die, highlighting 345 FP16 TFLOPS performance and advanced design.
Intel Panther Lake 18A (16th Gen Ultra X7 358H) Transistor Characterization
TCR details NMOS and PMOS transistor characteristics on Intel 18A compute die, featuring RibbonFET GAA and PowerVia backside power delivery.
200mm Watch
First 2026 update of the 200mm Watch provides the latest view on 200mm semiconductor trends and activity.
Baidu Kunlunxin P800 AI Accelerator Interconnect and Packaging Analysis
Reverse-engineering analysis of Baidu Kunlunxin P800 dives into the 2.5D packaging, interposer technology, substrate design, and more.
STMicroelectronics FX62A 28 nm FD-SOI ePCRAM Memory Process Flow Analysis
Process flow analysis of STMicroelectronics FX62A die, built on Samsung 28 nm FD-SOI with ePCM.
Free Access to Five Key Reports – Curated Each Month 🆓
March's five pieces of high-value analysis available to registered users for free.
Market Data: Industry Performance (TCI Graphics)
TechInsights latest insights on capital equipment, IC demand/supply, capacity, and end markets.
Company Earnings: SK hynix
Company Earnings: SK hynix 2 Min Read May 7, 2026 These reports provide key takeaways about SK hynix's demand and supply from their quarterly earnings call. This summary outlines the analysis* found on the TechInsights' Platform. Read The Analysis
Samsung Exynos 2600 Brings 2nm to Smartphones
Samsung’s Exynos 2600 marks a strategic shift, bringing the first 2nm smartphone SoC to market via vertical integration and new non‑monolithic die design.
Analysis: The $100 Billion Question: Can China Deliver Datacenter AI Performance Without NVIDIA?
Analysis examines whether expanded SMIC capacity and advanced packaging could enable China to offset export‑driven compute limits and compete in AI chips.