Featured Report Analysis
Qualcomm HB07D ultraBAW SMR die (QPM6670-000) Acoustic Wave Filter Report
Explore our in-depth analysis of Qualcomm’s SMR ultraBAW filter die HB07D, featuring TDK's Thin Film Acoustic Package (TFAP). Essential insights for RF filter designers, manufacturers, and the RF IC supply chain.
Analysis: An Intelligent Apple A Day
Discover the key AI features unveiled at Apple’s iPhone 16 launch event and how they could impact the company’s financial future. Explore our analysis of Apple's AI integration and commitment to privacy and security.
Qorvo EG9178 SMR Filter die (QM77180) Acoustic Wave Filter Report
Get in-depth insights on Qorvo’s SMR filter die EG9178 with structural, material, and architectural analysis.
Infineon CYW89570 AIROC Wi-Fi 6E/BT 5.3 LE Automotive SoC Floorplan Analysis
Discover the Infineon BT55909YA0 die in CYW89570 and Murata LBEE5XV2EA-802, and its role as an RF transceiver for mobile connectivity.
Samsung S5M6551 Wi-Fi 6/BT 5.4 Combo SoC Floorplan Analysis
Read our latest analysis of the Samsung S5M6551X02 die, extracted from the Galaxy Watch7, and explore its role as an RF transceiver for IoT connectivity.
YMTC’s New Xtacking4.0: YMTC found the solution to overcome the US ban?
Discover TechInsights' findings on YMTC's new Xtacking4.0 chip from the ZhiTai TiPlus7100 Black Myth SSD. Explore the 160L stacking layers, hybrid-bonded structure, and advancements in the 512 Gb Xtacking4.0 160L TLC chip (Gen5). Has YMTC overcome the US ban?
Brief View the YMTC Xtacking4.0 Technology: What’s new on the chip?
Discover the key differences between YMTC Xtacking4.0 (Gen5) and previous generations. Explore TechInsights' in-depth analysis of structure, process, and design advancements from Gen1 to Gen5 in 3D NAND technology, highlighting cutting-edge innovations in storage density, speed, and energy efficiency.
SmartSens SC100AT Standard Floorplan Analysis
Explore the in-depth analysis of the SmartSens SC100AT image sensor die, featuring 1.3 MP resolution and a 3.0 µm pixel pitch for automotive applications. This report includes foundry identification, key features, SEM cross-sections of periphery circuits, die functional floorplan, and cost details.
Tracker: Global 5G mmWave Smartphone Shipments Forecast by Vendor by Quarter to 2025
Explore global 5G mmWave shipment forecasts by 28 vendors from 2018 to 2025. Analyze trends in key regions including North America, Europe, and Asia Pacific, with a focus on leading vendors Apple and Samsung and their dominance in the US and Japan markets.
OECD Price Benchmarking Systems Country Overview 2024Q1 – France
Uncover key insights into France's competitive telecommunications sector with our Q1 2024 analysis. Explore pricing trends across fixed and mobile services using the latest TechInsights-Teligen OECD Price Benchmarking Systems. Stay informed on France's impact in global economic policy.
Insight: IFA 2024 Becomes PC Showcase as Intel Launches Silicon Critical to their Business’ Future
Discover the latest in AI-driven innovation at IFA Berlin 2024. Intel, Qualcomm, Asus, Acer, and Lenovo unveil groundbreaking mobile chipsets and AI-powered PCs, signaling a shift in consumer electronics. Explore how AI is transforming the future of PC hardware.
Memory Pricing Report – September 2024
Stay ahead of memory market trends with our monthly update. Explore the volatile pricing landscape of DRAM and NAND memory, featuring insights into Server DRAM, Mobile DRAM, SSDs, and more. Gain actionable forecasts for the year ahead.
UK Handset Vendor Marketshare by Operator: Q2 2024
Discover key insights on UK handset shipments, with 4.9 million units in Q2 2024. Apple leads the market, followed by Samsung and Xiaomi, while Oppo loses momentum. Explore quarterly market share trends from 2009 to 2024.
Samsung 200MP ISOCELL HP9 (S5KHP9SP) Device Essentials
Explore the Samsung S5KHP9SP, the first 200 MP telephoto image sensor with stacked BI CMOS, 1/1.4” optical format, and 0.56 µm pixel pitch.
2Q2024 Apple A and M series Apps Processor Market Share Model
Explore how Apple’s A-series and M-series application processors saw a 14% shipment increase and 24% revenue growth in Q2 2024. This report offers detailed estimates of shipments, revenues, and ASPs by chip model from Q1 2010 to Q1 2025.
System-on-Chip market accelerates in 2024 and 2025
Discover how System-on-Chip (SoC) technology drives innovation in smartphones, computing, and AI. This report explores SoC's role in performance and efficiency, its evolution to chiplets, and forecasts 17% revenue growth in 2024 with a 9% CAGR through 2029.
Analysis: Advanced Automotive Audio Systems Gaining Ground in China
Discover how Chinese automakers are shaping the future of intelligent cockpits and advanced audio systems. This report highlights the current development and future trends of audio technology in China's automotive market.
Qualcomm Cloud AI 100 Digital Floorplan Analysis
Explore the Qualcomm AIC100 graphics processor, featuring 16 AI cores, 144MB cache, PCIe Gen-4 lanes, and LPDDR4x memory. Discover detailed block functions with a digital floorplan and get insights into manufacturing costs.
