Webinar
The Silicon Bridge and Heterogeneous Integration Webinar
Featuring TSMC, Apple, Samsung, and the Jasminer X4—the first-ever observed DRAM-to-Logic hybrid bonding
Share This Post
Join TechInsights’ upcoming webinar, where we explore the unique approaches of TSMC, Apple, and Samsung when integrating Silicon Bridge technologies in their high-performance products. The webinar will cover the latest advancements in advanced packaging and discuss the different approaches to adopting Silicon Bridge technology.
Special Highlight: TechInsights' analysis of the Jasminer X4 revealed the first ever that we’ve observed DRAM-to-Logic hybrid-bonding technology with unique packaging techniques. Sign up and experience the innovative packaging strategy employed in Jasminer X4.
Join us on July 25 at 1:00 pm (EST; North America, Europe) or July 26 at 10 am (Korea, Japan) or 09:00 am (China, Taiwan).
In this 45-minute webinar, followed by a live Q&A, we will explore the following topics:
- Heterogeneous integration and the role of packaging
- Silicon Bridge technology
- Comparison of three Silicon Bridge technologies:
- Apple's M1 Ultra – TSMC's InFO-L
- AMD's Instinct MI210 – SPIL's EFOB
- Intel's Core i5-8305G SR3RM – Intel's EMIB
- The other approach: Jasminer X4
Register now to reserve your spot for July 25 at 1:00 pm (EST; North America, Europe) or July 26 at 10 am (Korea, Japan) or 09:00 am (China, Taiwan).
About the Speakers
Cameron McKnight-MacNeil - Process AnalystCameron is a Process Analyst and Packaging Subject Matter Expert at TechInsights, authoring subscription reports and patent analyses of advanced semiconductor packaging technologies. He regularly analyzes Logic, imaging systems, and power-switching devices. Cameron has worked in semiconductor failure analysis and reverse engineering for over 10 years, with experience in product development, marketing, and management.
