Survey Plus Teardown of the Apple iPhone 15 A3092 Smartphone

Survey Plus Teardown of the Apple iPhone 15 A3092 Smartphone

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The iPhone 15 A3092 features 64-bit ARM based Apple A16 Bionic Applications Processor APL1W10, which is built on a TSMC 4nm process node and an updated version of A15 Bionic. Additionally, A3092 also comes with Qualcomm’s Baseband Processor SDX70M-000. The BGA-POP package housing the Apple A16 Bionic APL1W10 Processor is integrated with 6 GB Mobile LPDDR5X SDRAM memory (H58GE6MK6HX131)from SK Hynix. KIOXIA provided a new128 GB 3D TLC NAND flash memory (KICK5A3). The iPhone 15 uses USI chip (339S01184) to provide Wi-Fi 6 and Bluetooth 5.3 connectivity. USI also offered new U2 UWB Transceiver module (339M00299) that included a TSMC’s 7nm process node. For this device Power Management ICs supplied by Apple, STMicroelectronics, and Qualcomm. Both audio ICs CODEC and Amplifier were manufactured by Apple/Cirrus Logic cooperation. However, RF ICs including Front-End Modules given by Skyworks, Broadcom and USI.

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