Still green but clouds loom

Andrea Lati
Andrea Lati
  • Order activity for semiconductor equipment extended its decline, slipping to 84 degrees
  • All segments trended lower led by Subcon/Adv. Packaging and SOC Computing where temperatures slid more than 4 points
  • The Assembly market, in particular, is feeling the brunt of the correction
  • Assembly sales increased by mid-single digits in 1H22 compared to last year; however, 2H22 sales are projected to tumble more than 25%
    • As a result, Assembly yearly sales are now on track to drop more than 10%
  • WFE activity is still holding up well and most WFE suppliers are not seeing any meaningful shift in demand yet
  • TechInsights’ Chip Price Performance Index Index continued to flash warning signals as it headed further south
    • DRAM tumbled
    • NAND declined
    • MPUs declined
  • Utilization rates are hovering around 97%

Capacity Utilization Rates

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