Qualcomm BB91C Surface Acoustic Wave (SAW) Filter Die from the Qualcomm QPM7815 MHB FEM Process Analysis
This report presents an acoustic wave filter process analysis of the Qualcomm BB91C Surface Acoustic Wave (SAW) Filter Die, from the Qualcomm QPM7815 MHB front end module. The die and module were extracted from the Samsung Galaxy S23 Ultra 5G smartphone.
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