NVIDIA H100 Hopper TSMC CoWoS-S Flip Chip Ball Grid Array
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This field is used for the Long Desc for the Report Store Item in the eStore. This report provides a deeper insight on the advanced packaging innovations used in the manufacturing of the nVIDIA Hopper GH100 GPU. The analysis includes structural and materials analysis, and critical dimensions, providing information on form factor as well as insights into the architecture attributes that may relate to performance or thermal management.
