MediaTek MT6985W Dimensity 9200 Processor Package-On-Package with Integrated Organic Interposer Advanced Packaging Quick Look Analysis
This quick look report provides insight on the advanced packaging innovations used in the manufacturing of the MediaTek MT6985W Dimensity 9200 Processor, using TSMC's InFO-B process. The analysis includes structural and materials analysis, and critical dimensions, providing information on form factor as well as insights into the architecture attributes that may relate to performance.
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