MediaTek Dimensity 9300 (N4P) Digital Floorplan Analysis

MediaTek Dimensity 9300 (N4P) Digital Floorplan Analysis

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This report presents a Digital Floorplan Analysis of the MediaTek AHJ11236C die extracted from the MediaTek MT6989W bottom of the package-on-package (PoP) processor found inside Vivo X100 Pro Smartphone (V2324A). The analysis includes structural analysis, critical dimensions, and layout analysis of digital blocks, along with die utilization calculations, including the total area for logic, I/O, memory, and analog components separately. This provides information and insights into the design and process attributes that may relate to performance. Additionally, foundry and process node identification, as well as cost analysis, are provided.

Released on November 21, 2023, the Vivo X100 Pro features Blue Crystal ×Dimensity 9300 chipset an octa-core CPU (1x3.25 GHz Cortex-X4 & 3x2.85 GHz Cortex-X4 & 4x2.0 GHz Cortex-A720, and integrates Immortalis-G720 MC12 GPU, RAM and ROM 16GB (LPDDR5X)+512GB (UFS 4.0), GPS, Wi-Fi 7 MIMO and Bluetooth 5.4 connectivity, AMOLED 2800 x 1260resolution display with pixel density 452 PPI and Front 32 MP / Rear 50 MP + 50 MP + 50 MP cameras. The one-inch main camera, equipped with Zeiss APO super telephoto lens and an ultra-wide field of view camera.

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