Huawei Pura 70 Ultra HBP-AL00 Smartphone Quickturn Teardown

Huawei Pura 70 Ultra HBP-AL00 Smartphone Quickturn Teardown

 
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Chiplets, which break down large, integrated system-on-chips (SoCs) into smaller functional blocks, are positioned to revolutionize the semiconductor industry. By allowing different companies to design and optimize these smaller blocks, the chiplet approach enables more innovative and efficient designs. The market for chiplets is projected to grow to $236 billion by 2030, driven by a compound annual growth rate (CAGR) of 19.7%. In the computing segment, unit shipments are expected to grow at a 24.1% CAGR, with significant contributions from Arm and RISC-V architectures.

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