CXMT CXDB6CCDM-MA G3 8Gb LPDDR4X Memory Floorplan Analysis

CXMT CXDB6CCDM-MA G3 8Gb LPDDR4X Memory Floorplan Analysis

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The CXMT CXDB6CCDM-MA die was found inside CXMT CXDB6CCDM-MA LPDDR4X DRAM package. The CXDB6CCDM-MA was extracted from the Tecno SPARK 20 smartphone. The Tecno SPARK 20 is a smartphone powered by the MediaTek MT6769Z Helio G85 SoC. It features 256 GB internal storage and 8 GB of RAM. This memory floorplan analysis (MFR) explores the CXMT CXDB6CCDM-MA die.

The CXMT CXDB6CCDM-MA is a FBGA package measuring 15.0 mm × 10.0 mm × 0.78 mm thick, with 200 solder balls at the bottom. The CXDB6CCDM-MA package contains eight 8 Gb LPDDR4X DRAM dies. The CXDB6CCDM-MA die measures 4.87 × mm × 9.17 mm (44.66 mm2) as measured from the die seals or 4.96 × mm × 9.26 mm (45.93 mm2) for the full die. The dies are devoid of any salient markings.

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