AMD Ryzen 9 7950X3D Processor TSMC SoIC Package Technology Advanced Packaging Quick Look Analysis
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This report presents an advanced packaging quick look analysis (APQ) of the AMD Ryzen 9 7950X3D (with second generation 3D V-Cache) processor TSMC SoIC package technology. The analysis includes structural and materials analysis, and critical dimensions, providing information on form factor as well as insights into the architecture attributes that may relate to performance.
