Latest Blogs and Commentary
AMD’s MI300 Targets HPC and AI
AMD’s MI300 accelerator will compete with Nvidia's Grace Hopper in the HPC and AI markets. It uses AMD's third-generation CDNA3 architecture and features x86, GPU, and memory die in a single package for improved performance.
Qualcomm Integrates Cockpit, ADAS
Qualcomm’s Ride Flex SoC combines ADAS and cockpit applications, integrating workloads that have no safety criticality with those requiring ASIL B and ASIL D safety.
TSMC Reveals 3nm Process Details
TSMC presented papers at IEDM detailing its 3nm N3 and N3E processes. N3 reduces CPP by 6nm compared with N5. SRAM cells are no smaller in N3E than in N5.
Memory Technology Trends and Challenges
Recently, TechInsights hosted a Memory webinar where Dr. Jeongdong Choe, Senior Technical Fellow at TechInsights, discussed the latest memory technology trends and challenges for DRAM and NAND devices.
TechInsights Critical Sub-systems Graphics file on Platform
TechInsights Critical Sub-systems Graphics file on Platform Updated CSUBS Graphics file is now available: Driving Forces Misc. Reports CSUBS Graphics 230203 CSUBS, Equipment, Macroeconomic quarterly CSUBS, Equipment sales forecast annual Supply Chain
SemiWEEK: Caution dominates decision-making; Chip War and Upturn Timing; Stocks continue to grow
Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.
Mobile RF – 2022 Webinar Recap
TechInsights hosted 3 webinars focused on Mobile RF technology and trends to watch for in 2022. With commentary, insights, and predictions from some of the top minds in the Mobile RF landscape, the TechInsights’ subject matter experts discussed who will be the dominant RF players, the different approaches taken to address the increased complexity brought by new standards, and the new antenna modules used by Apple in the iPhone 12 and 13.
Hybrid Bonding Technology - 2023 and beyond
Recently, TechInsights hosted a webinar where several experts from our Logic, Image Sensor, Memory, and Engineering teams reviewed applications of hybrid bonding technology and discussed what’s to come in 2023 and beyond.
TechInsights' Semiconductor Analytics report
TechInsights' Semiconductor Analytics report
Caution dominates decision-making
Caution dominates decision-making Shereen Vaux Order activity for semiconductor equipment held at a brisk 49 degrees The decline continues to moderate Memory slipped another degree in freezing levels while Other SOC compute fell two degrees Texas
Imagination DXT GPU Adds ALUs, TPUs
Imagination Technologies’ DXT GPU increases raw performance by 50% over the prior CXT generation. Although ray tracing remained in the headlines, changes to other circuits are responsible for this higher throughput.
AMD Phoenix Delivers AI to Notebook PCs
AMD is addressing notebook PCs from multiple directions, fielding a mobile Ryzen that integrates an AI accelerator and a high-performance Ryzen that has up to 16 CPUs and large caches.
Analysts’ Choice Winners for 2022
MPR recognizes the past year’s top products in the categories of data center, PC, embedded, smartphone, processor IP, and emerging technology. And the winners are...
Join TechInsights’ Leading Market Analysts at the 2023 Mobile World Congress
Leading market and technology analysts from TechInsights will be attending the Mobile World Congress (MWC) in Barcelona, Spain Feb. 27 – Mar. 2, 2023. During the event, our analysts will conduct business meetings, moderate conference sessions, attend briefings and provide media interviews.
Power of the Chip Series
This short-form video series will cover topical events and include insightful commentary from our TechInsight’s experts (and surprise guests) on how powerful this tiny object is.
Chip War and Upturn Timing
Chip War and Upturn Timing G. Dan Hutcheson The Chip Insider® Happenings, Comments, Questions & Answers: Japan and the Netherlands may join the U.S. in semiconductor equipment restrictions to China … an openly visible move to side with the U.S. would
SemiWEEK: The semiconductor industry is covered in a blanket of snow; SEMI ISS; Stocks rose
Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.
Lithography: Now and Then
Advanced lithography techniques, which are required to print ultrafine features on to chips, are primary enablers of modern technology advancement. There are many different lithographic techniques, with EUV considered the modern-day frontrunner leading the way to the world’s most advanced chips.
