Posted: June 11, 2019 Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU The MCU marketplace is crowded and competitive, with semiconductor companies globally increasing R&D spend in this technology area; this market is forecast to reach ~$20B USD in 2019
Posted: June 7, 2019 Samsung LPDDR4X 17 nm 1Y Samsung DDR4 17 nm 1Y Micron MT40A2G4SA-062E 8Gb DDR4 The top 3 DRAM manufacturers (Samsung, SK hynix, and Micron) reached sub-20 nm in 2017 and 2018 with the introduction of 1x. A new milestone was
Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges
Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L
Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor
Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time
Posted: May 14, 2018 TechInsights has found the Micron 1x nm process in the Micron DIMM (DDR4) and Huawei Mate 10 (LPDDR4). This process brings about smaller die sizes and increased bit density over its predecessor, but it also presented a bit of a
Posted: March 8, 2018 Samsung S5K2X7SP Image Sensor We did not expect to see the Samsung S5K2X7SP image sensor until Q2, 2018…but here it is in the Vivo V7+. The application is a 24 MP selfie camera that uses Samsung’s Tetracell platform (2x2 pixels
Posted: January 17, 2018 Toshiba 64L NAND – BiCS FLASH Toshiba released their 64L NAND solution (BiCS FLASH) in a SanDisk Ultra 3d SSD in 2017. TechInsights has conducted a significant amount of analysis on this product, including the following
Posted: January 17, 2018 Samsung 64L 3D V-NAND Samsung released their 64L 3D V-NAND solution in January of 2017 for key IT customers, and ramped up production in June for its expanded general market. The innovation included the following highlights
Posted: December 15, 2017 In April 2017, Samsung became the world’s first manufacturer to mass produce 10 nm-class DRAM. In June 2017, TechInsights published a blog based on our first learnings on this innovation that detailed a memory density
Posted: November 9, 2017 Intel/Micron 64L 3D NAND Analysis The Intel 545S SSD, introduced in June 2017, was the first product to include the Intel/Micron 64L 3D NAND, and one of the first SSD to use 64L. The device boasts a more compacted die
