Analysis: Advanced Packaging Investments Grow 2 Min Read May 25, 2026 AI demand is driving investment across the semiconductor value chain, with major new activity in advanced packaging. AI-related demand is driving investment up and down the semiconductor value chain, with segments outside of

Highlights of the AI coverage at TechInsights in April 2026: several frontier model releases, growing concerns over datacenter electricity needs, and impact on the chip market.

Elon Musk’s Terafab aims for massive compute scale, but memory remains the key question. Here’s what HBM, DRAM, and NAND requirements could look like.

This report details how automotive semiconductor demand will split out by each major carmaker group, application domain and semiconductor type.

Powertrain analysis report examines semiconductor demand across all major powertrain types, analyzing content per vehicle, domain-level splits, and the evolving competitive dynamics facing processor, power, and memory vendors through 2033.

Power Digest delivers a concise monthly roundup of key power semiconductor news, tech shifts, and insights across GaN, SiC, AI, and automotive.

Deep dive teardown of The Apple Macbook Neo includes detailed product disassembly analysis on unique construction, benchmarking, and cost data.

Deep dive teardown of The Samsung Galaxy S26+ US includes detailed product disassembly analysis on unique construction, benchmarking, and cost data.

Economy vehicles lead auto semiconductor growth, driven by China, while non‑premium retains scale as demand shifts with content and electrification.

Preliminary cost estimate for Huawei Pura 90 Pro uses historical component values, with pricing subject to change as deeper analysis is applied.

T1 2026 briefing reviews logic roadmap updates and highlights Intel 18A, showcasing GAA and backside power as key process milestones.

Advantest earnings insights reveal demand trends and supply dynamics shaping near‑term semiconductor test market outlook.