Presentations from the 2026 Critical Materials Council conference cover key discussions across materials and semiconductor priorities.

Congress advanced bipartisan export control bills covering enforcement, tech limits, and global coordination, though their legislative path remains uncertain.

Advanced Packaging Quarterly Q1 2026 synthesizes key analyses showing how packaging advances are driving scaling, AI performance, and adoption across end markets.

Intro presentation launches the Logic Scaling video series, tracing device scaling from planar transistors to CFETs and 2D devices through the 2030s.

Survey Plus report analyzes the Galaxy S26+ Exynos 2600, detailing IC suppliers, RF design, packaging, sub‑assemblies, and component pricing.

Survey Plus report analyzes the Galaxy S26+ Exynos 2600, detailing IC content, RF design, packaging, sub‑assemblies, and cost structure.

APE report details Samsung Exynos 2600 packaging innovations, highlighting redesigned FO‑WLP with Heat Path Block technology and improved thermal management.

Mobile devices are pushing PMICs to finer nodes and advanced packaging, with analysis spanning InFO, FO‑PLP, M‑Series, and module‑level PMIC integration.

Memory Floorplan Report analyzes device architecture using advanced imaging, identifying node and foundry, sizing memory blocks, and assessing die and package costs.

Advanced floorplan analysis examines OmniVision’s OV50X ISP die, a 50 MP 1″ stacked BI image sensor used in Xiaomi Tech 17 Ultra cameras.

H1 2026 Wi‑Fi/IoT SoC briefing reviews Wi‑Fi, UWB, and Bluetooth technologies, radio designs, process nodes, foundries, and die costs.

Cisco unveils a quantum switch that enables interoperability across quantum systems, paving the way for a scalable Quantum Internet.