In consultation with our RF Subject Matter Expert, Radu Trandafir, and Technical Product Manager, Van Thompson, here’s a quick rundown of the top mobile phones to watch for in 2023 with potential significant RFFE innovation.
The Power semiconductor market is in for a difficult year with the high demand for vehicle electrification and clean energy, leaving power semiconductors in a shortage. Read the blog for TechInsights’ predictions and discoveries on market consolidation, which is a growing trend in terms of wide bandgap semiconductor material supply.
At the end of Part 2 of the blog we had reached 2009 and the 40-nm generation; which put TSMC out of sync with other companies, who were marketing their 45-nm product. That discrepancy continued with the usual 70% shrink to the next node, 28-nm for TSMC and 32-nm for IDMs such as Intel and IBM.
Recently, TechInsights hosted a Memory webinar where Dr. Jeongdong Choe, Senior Technical Fellow at TechInsights, discussed the latest memory technology trends and challenges for DRAM and NAND devices.
TechInsights hosted 3 webinars focused on Mobile RF technology and trends to watch for in 2022. With commentary, insights, and predictions from some of the top minds in the Mobile RF landscape, the TechInsights’ subject matter experts discussed who will be the dominant RF players, the different approaches taken to address the increased complexity brought by new standards, and the new antenna modules used by Apple in the iPhone 12 and 13.
Recently, TechInsights hosted a webinar where several experts from our Logic, Image Sensor, Memory, and Engineering teams reviewed applications of hybrid bonding technology and discussed what’s to come in 2023 and beyond.
Leading market and technology analysts from TechInsights will be attending the Mobile World Congress (MWC) in Barcelona, Spain Feb. 27 – Mar. 2, 2023. During the event, our analysts will conduct business meetings, moderate conference sessions, attend briefings and provide media interviews.
This short-form video series will cover topical events and include insightful commentary from our TechInsight’s experts (and surprise guests) on how powerful this tiny object is.
Advanced lithography techniques, which are required to print ultrafine features on to chips, are primary enablers of modern technology advancement. There are many different lithographic techniques, with EUV considered the modern-day frontrunner leading the way to the world’s most advanced chips.
CMOS image sensors (CIS) have continued to evolve in response to performance requirements of current applications of Smartphone Imaging, Security Surveillance, Biometrics, Automotive and Depth Sensing and Ranging.
Apple’s annual big reveal in September 2022 promised an iPhone 14 with “a re-engineered proximity sensor”, detecting light from behind the display to save additional space. This is the type of announcement the CIS subscription likes to hear about, and indeed our initial teardown analysis showed that Apple decided to change their approach to the proximity sensor.
The innovation seen within smartphones, including increasingly faster charging speed, has been exciting to watch over the past year. Key players like Xiaomi, Realme, Samsung, and Black Shark are leading the pack in this space with Xiaomi and Realme as the top competitors, surpassing 100 W.
The memory technology landscape is continuously evolving. DRAM and NAND Flash memory demands have been steadily increasing and emerging memory markets such as STT-MRAM, ReRAM, PCRAM, FeRAM, and 3D XPoint memory are expected to reach $36 billion by 2030. As emerging memory makers race ahead of device scaling, they will face several challenges.
"It was a busy year in the IoT connectivity landscape in 2022. TechInsights’ team of subject-matter experts and analysts worked hard at identifying the key events, technologies, and design practices to include in our IoT SoC subscription."
TechInsights ran a comparison of the YMTC 232-L against 128- and 176- layer solutions from Samsung, SK hynix, and Micron, looking at factors like die size, bit density, active layers, word line pitch, and more.
