Advanced Packaging Demand Forecast and Analysis H1 2025
2 Min Read September 18, 2025
Get insights on the global demand for advanced semiconductor packaging, covering device types, interconnect types, and silicon demand through 2030.
H1 2025 update to the Advanced Packaging Demand forecast. This report covers worldwide advanced semiconductor package demand by device type (ICs and discretes) and also by interconnect type package type through 2030. It also includes the worldwide silicon demand for advanced packaging including flip chip, fan-in wafer level packaging, fan-out wafer level packaging, 2.5D, and 3D packaging.
