This report presents a Basic Package Analysis of the TSMC fingerprint sensor used by Apple in the iPhone 6s for their Touch ID fingerprint recognition feature. The iPhone 6s fingerprint sensor package frame is provided by a stainless steel bezel in a shape of a rectangle with rounded corners. The package is 12.5 mm long, 10.8 mm wide, and 1.2 mm thick. Inside the package, there is a capacitive silicon (Si) sensor die.