Latest Blogs and Commentary
Deep Dive Teardown of the Luminar Technologies Iris LiDAR 70-0034-00102203A15650 Automotive
The Luminar Iris seems to have different versions. The latest one is equipped with the flagship EX90 electric car from Volvo as the main sensor supporting autonomous driving system.
Intel Innovation 2023: It’s grand strategy revealed
The Chip Insider®
Sony IMX695AFR, Advanced Photo System Type-C (APS-C) Format, 26.1 MP Resolution, 3.77 μm Pixel Pitch, Stacked Back-Illuminated CMOS Image Sensor Device Essentials Folder
This report presents a device essentials folder (DEF) of Sony IMX695AFR Advanced Photo System Type-C (APS-C) Format, 26.1 MP Resolution, 3.77 µm Pixel Pitch, Stacked Back-Illuminated CMOS Image Sensor, extracted from Fujifilm X-H2S mirrorless camera.
Automotive Cockpit Domain Controllers: 2023 Market Update
Cockpit domain controllers (CDCs) represent one of the first types of systems with features that were previously in separate electronic control units, which support more than just infotainment, for example safety-critical functions, such as the instrument cluster, occupant monitoring, driver monitoring, and other ADAS features.
Analysis: Connectivity Technologies Forecast to 2028
The modern smartphone incorporates dozens of different wireless and wired technologies for charging, connections, and communication.
Global Smartphone Sales Forecast by Wireless Connectivity Technologies to 2028
The modern smartphone incorporates dozens of different wireless technologies for charging, connections, and communication. From UWB to Bluetooth to WiFi the modern smartphone is a complex powerhouse of wired and wireless technologies.
Global Smartphone Sales Forecast by Wired Connectivity Technologies to 2028
The modern smartphone incorporates dozens of different wired technologies for charging, connections and communication. From USB-C to Display Port to 3.5mm plug, the modern smartphone is a complex powerhouse of wired technologies.
Deep Dive Teardown of the Google Pixel Fold G9FPL Smartphone
The Google Pixel Fold features a relatively unorthodox design with two separate pieces serving as endcaps of the hinge cover. The more typical design, such as that in the Samsung Galaxy Z Fold4, Huawei Mate X3, or other foldables, is where the mechanical elements are present along most of the length of the hinge.
Deep Dive Teardown of the SuperMicro GPU SuperServer SYS-741GE-TNRT GPU Server
The Supermicro server contains two Intel Xeon Sapphire Rapids processors. It has a mechanical structure typical of professional servers in this class.
Deep Dive Teardown of the Honor X50 ALI-AN00 Smartphone
The Honor X50 was supplied for the first time by Qualcomm octa-core Snapdragon 6 Gen 1 processor SM6450-500-AB with package size 12.54 × 12.04 mm while the die size was 8.05 × 6.65 mm.
Driving Towards a Sustainable Future with Electric Vehicles
The global automotive landscape is undergoing a profound transformation as the race toward sustainability gains momentum. Governments and consumers alike are pushing for a greener, cleaner, and more sustainable approach to transportation. In this blog, we'll explore how various countries, including the European Union, the United States, and China, are setting the stage for a future dominated by electric vehicles (EVs).
Cadence Boosts DLA Speed By 20×
Cadence’s Neo AI licensable IP block provides up to 80 TOPS of performance. Its NeuroWeave SDK unifies AI design across all Cadence IP options.
Intel Core Ultra Accelerates AI
Accelerated AI is a key feature of Intel’s forthcoming Core Ultra (Meteor Lake) processors.
Hexagon Adds INT4 Support
Peak raw performance of the Hexagon-based AI accelerator in Qualcomm’s newest flagship smartphone processor is 4× greater than that of the previous generation.
Generative AI Takes Alexa and its Smart Home Ecosystem to The Next Level
Generative AI Takes Alexa and its Smart Home Ecosystem to The Next Level Share This Post On September 20, Amazon hosted its annual devices and services event that evolved at a notably slower pace, and with fewer new product announcements than in the
TechInsights' Semiconductor Analytics Report
TechInsights' Semiconductor Analytics Report
SK hynix H56G42AS8D-X014 D1y 8Gb GDDR6 HKMG DRAM Memory Floorplan Analysis
This is a Memory Floorplan Analysis (MFR) of the SK hynix GDDR6 H56G32CS die with a memory capacity of 8 Gb and a D1y generation node.
Order Activity is Cautiously Warming up
Order Activity is Cautiously Warming up Shereen Vaux Order activity for semiconductor equipment increased to 56 °F. Order activity continues heating up for subcontractors/advanced packaging to alleviate the bottlenecks still seen there. Micron’s
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