Latest Blogs and Commentary
Renesas, TSMC Embed Fast MRAM
Renesas and TSMC demonstrated two uses of fast MRAM at ISSCC. Renesas targets faster NVM; TSMC targets working memory. Their tradeoffs are very different.
ST Introduces Its First 64-Bit SoCs
The STM32MP2 devices integrate up to two Cortex A35 CPUs with a substantial number of I/Os for embedded industrial applications.
Survey Plus Teardown of the Xiaomi Redmi Note 13 23129RAA4G Smartphone
The Redmi Note 13 comes with a 120 Hz, 6.67-inch AMOLED touchscreen display offering a resolution of 1080 x 2400. Xiaomi Redmi Note 13 has four cameras.
Survey Plus Teardown of the Samsung Galaxy A15 SM-A155M Smartphone
Most of the main SoC in the Samsung Galaxy A15 4G are from Mediatek. In the comparison of the Samsung Galaxy A14 4G it has Octa-Core Helio G99 Applications/Baseband Processor (MT6789V-CD), Power Management (MT6366MW), and RF Transceiver (MT6186MV) chips.
Deep Dive Teardown of the Meridian Kia EV6 Audio Amplifier 96370-CV100 Automotive
The Meridian 96370-CV100 is a high-end audio 11 Cannel Amplifier that was designed Meridian Audio. This system is available in the KIA EV6. Communication between the audio amplifier and the audio elements in the car happens through one main connector.
Deep Dive Teardown of the Denso Toyota Prius Front Windshield Camera 8646C-47130 Automotive Camera
Designed by Denso, the Vision Sensor Camera is a part of the Toyota Prius safety and driver assistance system. It combines a millimeter-wave radar sensor and vision sensor to assist the driver in safely controlling the vehicle.
Deep Dive Teardown of the Xiaomi Redmi Note 13 Pro 2312CRAD3C Smartphone
Released in September 2023, the Xiaomi Redmi Note 13 has been equipped with Qualcomm’s Octa-Core Snapdragon 7s Gen 2 Applications/Baseband Processor # SM7435-100-AB, made in 4nm technology. Memory was provided by Micron and contains 12 GB Mobile LPDDR5 SDRAM and 512 GB 3D TLC NAND Flash.
STMicroelectronics Ouster L3 Chip Third-Generation Direct Time-of-Flight CMOS Image Sensor Device Essentials Plus
The Ouster OS1 Mid-Range High-Resolution Imaging LiDAR incorporates the new REV7 sensor that uses the L3 Digital LiDAR Chip. This L3 chip is a stacked back-illuminated (BI) direct time-of-flight (d-ToF) fabricated by STMicrolectronics. The L3 chip uses single photo avalanche diode (SPAD) pixels to analyze the IR signal that is returned to the LiDAR from the emitting source located in the LiDAR.
YMTC 1.33Tb 128L QLC 3D NAND Internal Waveform Overview
The following is an Internal Waveform Overview containing the program, read, and erase waveforms for the YMTC 1.33 Tb 128L quad-level-cell (QLC) 3D NAND flash memory device (die markings: CEC1A). This device is packaged inside the YMTC YMC4G0W1TbG1AA1C0 NAND flash memory package, which was found on the HikSemi HS-SSD-V300 2.5 inch SATA 6 Gb/s 512 GB solid state drive (SSD).
Smartphone On-Device AI Chip Market Share Tracker Q4 2023: Mobile AI Becomes Table Stakes
Global smartphone apps processors (AP) with on-device artificial intelligence (AI) increased 26 percent year-over-year in Q4 2023 as the mobile chip industry rebounds from a market slump. Qualcomm's and Apple APs continue to dominate the absolute volume of on-device AI designs in Q4 2023 with MediaTek making significant gains with their latest Dimensity 9300.
Deep Dive Teardown of the TiVo Stream 4K IPA1104HDW-01 Streaming Media Stick
Several manufacturers share design Wins for the TiVo Stream 4K IPA1104HDW-01. The main SoC came from Amlogic. For this device, Nanya supplied 2 GB LPDDR4 SDRAM. Whereas NAND memory comes from Samsung and offers 8 GB MLC NAND Flash.
Hybrid Technologies Legislation/Support
This database has collated the various incentives and legislation used to promote the development, manufacture and sales of electric and hybrid vehicles. It focuses on over 1,000 incentives and mandates, from Europe, North America and significant highlights from other regions.
EV/HEV Technologies Supply & Fitment Database
This database has collated the various developers and suppliers of starter-alternators, electric motor-generators and batteries for each battery electric, hybrid and fuel cell vehicle model that has been assembled since 1997, is being planned for future production or is being developed for possible future deployment.
Deep Dive Teardown of the Huawei Qingyun L540-001 Laptop
The Huawei is a laptop that features a fan-based cooling system. Between the processor and heat pipe there is a lot of thermal paste. The laptop is equipped with a cooling fan that helps to dissipate heat from the internal components, including the CPU.
Global Fitness Band Vendor Market Share by Region: Q4 2023
Global Fitness Band shipments plummeted by over 40% year-over-year (YoY) for the third consecutive quarter during Q4 2023. Slumping demand for the market leading Xiaomi Mi Band line as well as a market exit from Samsung, in addition to macroeconomic weakness, geopolitical uncertainty, and continued high inflation stifling consumer discretionary spending contributed to the downtick. Consumers are trending away from fitness bands and toward smart and feature watches.
Global Smartwatch OS Market Share by Region: Q4 2023
Global smartwatch shipments declined for the fifth consecutive quarter during Q4 2023, after Q4 2022 marked the first year-over-year (YoY) decline since 2016 as the smartwatch space begins to mature and consumers reign in discretionary spending causing a lengthening replacement cycle amid macroeconomic weakness.
North American 5G Smartphones Country Forecast to Q4 2025
5G smartphone shipments in North America in Q4 2023 accounted for over nine in ten of total smartphone shipments in the region. The US accounted for more than nine in ten of all 5G smartphones shipped in the region in the quarter. Apple was the leading 5G smartphone vendor and Samsung was the leading Android 5G smartphone vendor. This report tracks 5G smartphone shipments for the top vendors in the US by quarter from Q1 2019 and forecasts shipments through 2025. It is a valuable tool for all stakeholders who want to track the influential North American 5G market.
AI Notebook PC Forecast: 95% AI-Capable Shipments by 2029
AI-capable notebook PCs– defined as a notebook PC that ships with a dedicated chipset built specifically to accelerate AI computing on device (i.e. an NPU) –will represent 95% of the total notebook PC market, or 230.5 million units, shipped in 2029.