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The iPhone 17 Pro Max introduces a major IR sensor redesign. See how STMicroelectronics’ new architecture reshapes biometric imaging.
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TechInsights’ teardown of the Huawei Mate 80 Pro Max confirms the Kirin 9030 Pro on SMIC’s N+3 process and reveals major upgrades in display, cameras, and connectivity.
2026 Advanced Packaging Outlook Report
Discover the five expectations defining advanced packaging in 2026, including CPO adoption, HBM4 demand, panel and glass scaling, 3D thermal challenges, and chiplets for mobile.
The Authoritative Information Platform to the Semiconductor Industry.
