TechInsights for Automotive

Autonomous Vehicles

TechInsights’ Autonomous Vehicles coverage offers forecasts and analysis both of today’s ADAS technologies as well as an expert, independent view on what the future of automated driving will bring, and where the resulting opportunities will lie. It includes deep coverage at the system, semiconductor and sensor levels, as well as a broad view of whole value chain.

Powertrain Body Chassis Safety

TechInsights’ Powertrain, Body, Chassis and Safety is the industry’s premier source of market information on the complex global automotive electronics market. It covers over 100 different automotive electronics systems, including the resulting semiconductor and sensor demand. It also assesses the impact of vehicle architecture change on the automotive ecosystem.

In-Vehicle UX

In-Vehicle UX gives you instant access to our extensive consumer research and analysis of the latest trends impacting the automotive user experience.

ADAS Controller Teardown

ADAS Controller Teardown provides curated data with technical insight on ADAS to reveal design wins and provide valuable context on how individual components contribute to the larger picture. They include: ICs identification and costing, reports containing pictures of circuit boards with annotated ICs, major sub-assemblies and antennas, die photos for major ICs and tables for features descriptions and dimensional data, costed bill of materials (BOM) spreadsheets, RF block diagrams, system block diagrams.

ADAS Design Material & Assembly

ADAS Design Material and Assembly provides detailed teardown photos and annotations describing assembly techniques, material function, material composition, IC selection and mechanical features of modules to help OEMs reach mass market deployments quickly and cost-effectively. It also includes:

Isometric views of the products with dimensions and callouts of major mechanical or other visible features contributing to specific functions

Images of subassemblies and their major components

Weights and dimensional attributes of key components

Materials, fabrication processes, assembly processes and features, PCB dimensions and fabrication details*

Surface treatments*

Thermal solutions

Environmental/EMI (electromagnetic interference) and EMC (electromagnetic compatibility) seals

IC selection

* = Where identifiable

Automotive Connected Mobility

TechInsights’ Automotive Connected Mobility covers all key aspects of car subscriptions, Mobility as a Service, car sharing, and ride hailing. It includes analysis of the regulatory environment, OEM strategies, business models, user experiences, and financial performance of public and private entities in these markets. Our analysis helps you understand current market trends and what the implications of them are for your company. Our analysts help you unpack the numbers to give you a competitive advantage.

Transceiver Architecture

TechInsights' IoT Connectivity SoC Transceiver Architecture coverage enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge IoT transceiver chipsets in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more. It includes and extends Transceiver Floorplan analyses to identify key functional blocks and the connections between them.

Transceiver Floorplan

TechInsights' IoT Connectivity SoC Transceiver Floorplan provides insight into competitive designs including high-level block identification, high-level process data, and manufacturing costs for leading-edge transceivers in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more.

Transceiver Architecture

TechInsights' Transceiver Architecture enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge 5G and FR2 transceivers. It includes and builds on the Transceiver Floorplan content to identify key functional blocks and the connections between them.

Transceiver Floorplan

TechInsights' Transceiver Floorplan provides insight into competitive designs including high level block identification, high level process data and manufacturing costs for leading-edge 5G and FR2 transceivers in flagship handsets across market leaders and disruptors.

Electric Vehicles

TechInsights’ Electric Vehicles coverage offers forecasts and analysis of the rapidly-growing and strategically vital electric vehicle market. It offers deep analyses at the system, semiconductor, and sensor levels, as well as a broad view of the whole value chain, along with valuable insights covering global and regional regulatory and policy dynamics, OEM strategies, emerging technologies, and economies.

In-Vehicle UX

In-Vehicle UX gives you instant access to our extensive consumer research and analysis of the latest trends impacting the automotive user experience.

Battery Cell Essentials

TechInsights' Battery Cell Essentials profiles the innovations impacting battery life extension, energy density, safety, cost reduction, charging speed, etc. The analysis includes materials and structural analysis (anode, cathode, electrolyte, and separator) of innovative lithium-ion battery cells found in phones, wearables, laptops, tablets, pens, and more. The analysis will also show details of the battery pack, its fit in the source device, and the components found on the battery protection control module.

Battery Characterization

TechInsights' Battery Characterization covers cells from a range of market applications, with a focus on mobile and smaller (wearables, pens, etc.) form-factors from leading OEMs. The analysis provides insight into the thermal characteristics of devices during wireless and wired charging as well as lithium-ion battery performance during operation over a range of different conditions.

Camera Teardown

Camera Teardown provides curated data with technical insight on cameras to reveal design wins and provide valuable context on how individual components contribute to the larger picture. They include:

ICs identification and costing

Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas

Die photos for major ICs and tables for feature descriptions and dimensional data

Costed bill of materials (BOM) spreadsheets

RF block diagrams

System block diagrams
 

LiDAR Design Material & Assembly

LiDAR Design Material and Assembly provides detailed teardown photos and annotations describing assembly techniques, material function, material composition, IC selection and mechanical features of modules to help OEMs reach mass market deployments quickly and cost-effectively.

LiDAR Teardown

LiDAR Teardown provides curated data with technical insight on LiDAR to reveal design wins and provides valuable context how individual components contribute to the larger picture. They include:

ICs identification and costing

Report containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas

Die photos for major ICs and tables for features description and dimensional data

Costed bill of materials (BOM) spreadsheet

RF block diagram

System block diagrams
 

Circuit Analysis

TechInsights' Circuit Analysis includes hierarchical schematics, delivered in a highly interactive, easy-to-navigate environment including cross-probing to layout capability, of the active pixels, column readout, ADC, row control, ramp generator, and bandgap.

Device Essentials

TechInsights' Device Essentials provides broad coverage of the enabling technologies and pixel architectures in use in array imagers, time-of-flight (ToF), event-driven, biometric, and other optical sensors. Tactical reporting on new solutions as they come to market is augmented by curated analyst content.

Image Signal Processor

TechInsights' Image Signal Processor content provides insights into the functional blocks and die utilization of stacked and standalone image signal processors. This content provides floorplan (functional) analysis of image signal processors (ISP) in applications such as smartphone, automotive imaging and optical sensing, computer/machine vision, edge AI, IoT, LiDAR, security/ surveillance, and more.

Infotainment & Telematics

TechInsights’ Automotive Infotainment and Telematics covers all key aspects of in-vehicle infotainment, wireless communication, and connectivity adoption in the connected car. It includes detailed semiconductor and system market sizing, including unit, revenues and ASPs, along with granular Tier 1 and semiconductor supplier market shares. It also looks at software trends, including OS usage, and OTA implementations.

In-Vehicle UX

In-Vehicle UX gives you instant access to our extensive consumer research and analysis of the latest trends impacting the automotive user experience.

Audio Amplifier Teardown

Audio Amplifier Teardown provides curated data with technical insight on audio amplifiers to reveal design wins and provides valuable context on how individual components contribute to the larger picture. They include:

ICs identification and costing

Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas

Die photos for major ICs and tables for feature descriptions and dimensional data

Costed bill of materials (BOM) spreadsheets

RF block diagrams

System block diagrams
 

Infotainment Teardown

Infotainment Teardown provides curated data with technical insight on infotainment to reveal design wins and provides valuable context how individual components contribute to the larger picture. They include:

ICs identification and costing

Reports containing pictures of circuit boards with annotated ICs, major sub-assemblies, antennas

Die photos for major ICs and tables for feature descriptions and dimensional data
Costed bill of materials (BOM) spreadsheets

RF block diagrams

System block diagrams

AI Processor Service

AI Processor content covers hardware technologies and products from leading AI companies. It provides deep technology analysis and head-to-head product comparisons, as well as analysis of company prospects in this rapidly developing market segment. We explain which products will win designs and why. TechInsights’ AI Processor content provides a forward-looking view, helping sort through competing claims and products.

Digital Floorplan

TechInsights' Digital Floorplan is a high-level view of SoC design quality, focusing on leading-edge APU, CPU, GPU, AI accelerator, FPGA, baseband / connectivity, VPU, advanced MCU components, plus emerging applications such as AR and vision processing SoCs.

Microprocessor Report Enterprise License

This industry-leading weekly journal covers new Microprocessors and SoCs, providing insight into their target application and market, and differentiation from their competitive products. This will expand your access to more of the information you need to compete globally and enhance your ability to make fact-based decisions that will impact your business faster and more effectively.

Chip Insider (CMRS TCI)

The Chip Insider is a go-to resource for senior semiconductor executives. It provides straightforward reports on current industry issues, trends, strategies, and tactics. Get insider insights on supplier-customer dynamics, corporate strategies, industry trends, challenges, projections, and historical facts, presented in a clear and informative manner. 

TCI Graphics

TechInsights' TCI Graphics content provides a unique view into the health of the semiconductors manufacturing ecosystem, including key performance indicators across electronics, semiconductors, and equipment supply chains with simple charts to communicate changes in the market with weekly and monthly views.

The McClean Report

The McClean Report helps you identify how to better position your business to be competitive. You don’t have to be an expert in semiconductors to understand the broad variety of analyses and perspectives, and how The McClean Report can complement your business, and your business decision-making – not only from the technical or legal point of view but also from the geopolitical, and regional market(s) angle.

Semiconductor Analytics

Semiconductor Analytics provides weekly data visualization on semiconductor supply and demand analysis, and provides granular level sales per week and allows for quarterly and yearly comparisons.

Powertrain Body Chassis Safety

TechInsights’ Powertrain, Body, Chassis and Safety is the industry’s premier source of market information on the complex global automotive electronics market. It covers over 100 different automotive electronics systems, including the resulting semiconductor and sensor demands. It also assesses the impact of vehicle architecture changes on the automotive ecosystem.

Power Essentials (Process - GaN, SiC, Si)

TechInsights' Power Essentials provides in-depth process analysis for GaN, SiC, and Si power devices, and comprehensive coverage of device metrics and salient features. Analysis includes detailed structural and material analysis using techniques such as SEM, TEM, and SCM/sMIM, covering package and die images/X-rays, SEM Planview and cross-sectional images with annotated SEM-EDS material analysis conclusions, and cross-sectional TEM images with annotated TEM-EDS/EELS analysis conclusions for GaN devices, cross-sectional and planar SCM (sMIM) analysis for Si and SiC.

Silicon Carbide Process Flow

TechInsights' Silicon Carbide Process Flow provides in-depth process flow analysis detailing the manufacturing steps to fabricate innovative SiC power devices from wafer-in to wafer-out. Analysis includes process architecture, mask list, and integration-level process steps, layout (.GDS) decomposed into process layers, and emulated device structure, tool type as well as design rules, layer dimensions, and process assumptions.