This report presents a package analysis (PKG) of the Sony IMX989 50 MP, 1" wide-angle rear main camera, extracted from the Xiaomi 12S Ultra 5G smartphone.
The PKG includes observed device metrics and salient features supported by the following unannotated image folders:
- Package photographs and X-ray images
- Die photographs
- Optical and SEM package cross-section photographs
- SEM-EDS spectra of selected package materials
The image set for a PKG project is derived from a package cross sectional analysis, supplemented by jet etch decapsulation, when applicable. Value added information, such as additional planes of cross-sectioning, may be included on a case-by-case basis.
The PKG deliverable provides competitive benchmarking information and enables cost-effective tracking of multiple competitors' technology.