This report presents a Basic Functional Analysis of the ELAN Microelectronics EUAS09A die found inside the ELAN Microelectronics 33221B-3B00 touchpad controller package. This report contains the following detailed information: • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs • Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors • Measurements of vertical and horizontal dimensions of major microstructural features • Plan-view optical micrograph of the die delayered to polysilicon • Identification of major functional blocks on a polysilicon die photograph • Table of functional block sizes and percentage die utilization • High resolution top metal and polysilicon die photographs delivered in the ICWorks Browser