This report presents a Basic Functional Analysis of the Apple TMKP88 die found inside the Apple A8X APL1012 flip-chip ball grid array (FCBGA) package, which is an application processor device. The A8X was extracted from the Apple iPad Air 2 tablet. Fabricated in TSMC’s 20 nm process, the A8X packs a triple-core CPU, octa-core GPU, and 128 bit DDR3 memory interface.