GoPro GP2 Processor TSMC 12FFC FinFET Digital Floorplan Analysis

Product Code
DFR-2202-803
Release Date
11/08/2022
Availability
Published
Product Item Code
SOI-SCM803A
Device Manufacturer
Socionext
Report Code
DFR-2202-803
Image
This report presents a digital floorplan analysis (DFR) of the GoPro GP2 processor, fabricated using TSMC's 12FFC FinFET process.
This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at levels including fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
  • Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
  • Plan-view optical micrograph of the die delayered to the metal gate level
  • Identification of major functional blocks on a gate level die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and gate level die photographs delivered in the CircuitVision software
  • Cost of die based on the manufacturing cost analysis of the observed process
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