HiSilicon Kirin 990 5G TSMC 7 nm FinFET (N7+ EUV) Process Digital Floorplan Analysis

Product Code
DFR-1911-801
Release Date
13/12/2019
Availability
Published
Product Item Code
HSL-Hi3690
Device Manufacturer
HiSilicon Technologies Co. Ltd
Device Type
Applications Processor
Report Code
DFR-1911-801
This report presents a Digital Floorplan Analysis of the HI3690 V200 die found inside the HiSiliconKirin 990 5G (Hi3690) application processor package. The Hi3690 processor was extracted from the Huawei Mate 30 Pro 5G smartphone (model LIO-AN00).
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