HiSilicon Hi3690 Kirin 990 4G TSMC 7 nm FinFET (N7) Process Digital Floorplan Analysis

Product Code
DFR-1910-801
Release Date
05/12/2019
Availability
Published
Product Item Code
HSL-HI3690_V100
Device Manufacturer
HiSilicon Technologies Co. Ltd
Report Code
DFR-1910-801
This report presents a Digital Floorplan Analysis of the HI3690 V100 die found inside the HiSilicon Kirin 990 4G (Hi3690) application processor package. The Hi3690 processor was extracted from the Huawei Mate 30 Pro 4G smartphone (model LIO-AL00).
TechInsights Library

A unique vault of trusted, accurate data at your fingertips

Our analysis goes as deep as required to reveal the inner workings and secrets behind a broad range of products.