This report is an Analog Circuit Analysis of the radio frequency (RF) transceiver, buck-boost converter and its low drop outs (LDO) regulators, XTAL 16 MHz driver, reference generators, and other control circuits that support the radio transceiver and DC-DC converter. The DA14580 die was fabricated using a seven metal layer interconnect process including one top aluminum (Al) metal redistribution layer (RDL), six copper (Cu) layers, tungsten (W) contacts, a single polysilicon layer, shallow trench isolation (STI), and likely nickel platinum silicided (NiPtSi) polysilicon gates and source/drain (S/D).