This report presents an advanced packaging analysis (APE) of the AMD Ryzen 7 5800X3D with 3D Vertical Cache (V-Cache) and TSMC chip-on-wafer technology.
The complete APE deliverable includes:

• Detailed analyst's summary of critical device metrics, SEM and SEM-EDS of package materials, and salient features supposed by the following images:
• Downstream product teardown
• Package photographs and X-rays
• Die photographs
• Optical planar view images of selected PWB metal layers
• SEM and optical cross-section of the general package structure, metals, dielectric materials, die and package interconnect structure.