This report presents an advanced CMOS essentials (ACE) analysis of the Apple APL1W07 A15 Bionic die found inside the Apple iPhone 13.
The complete ACE deliverable includes this concise analysis summary report of critical device metrics, transmission electron microscopy (TEM) based energy dispersive X-ray spectroscopy (EDS) and electron energy loss spectroscopy (EELS) results, and salient features supported by the following image folders:
- Downstream product teardown
- Package photographs and X-rays, top metal and poly die photographs
- SEM bevel
- SEM cross section of the general device structure, metals, dielectrics, and detail of the front end of line (FEOL) structures
- TEM bevel (including some high-angle annular dark-field scanning TEM (HAADF STEM) images)
- TEM cross section
- Orthogonal to transistor fins
- Orthogonal to transistor gates