Japan handset shipments grew by 9% annually in Q4 2023. As usual, Apple continued to capture top positions through all local Japanese operators including Rakuten Mobile. Our extensive report has tracked the major handset vendors' marketshare by quarter at all major operators in Japan, including NTT Docomo, Softbank and KDDI from Q1 2012, and we started to track Rakuten Mobile, a new MNO launching the services since Q2 2020.

This report presents a Basic Floorplan Analysis (BFR) of the Qualcomm HG11-13972-2 die found inside Qualcomm SDR875. The SDR875 was extracted from the Samsung SM-S928U1 Galaxy S24 Ultra 5G smartphone.

This is an Advanced Packaging Quick Look (APQ) summary document comparing the Kirin 9000 and the Kirin 9006C processors, provided as a companion deliverable for APQ-2312-802 projects. In 2020, the US government enacted sanctions on Huawei and HiSilicon, constraining their access to manufacturers and markets outside of China.

This report presents a Digital Floorplan Analysis (DFR) of the Apple TMRJ66 die found inside the Apple APL1201 system-in-package (SiP). The Apple APL1201 SiP was extracted from the Apple iMac M3 24-inch display desktop computer (A2874).

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At the 2024 Mobile World Congress, anticipation swirls around the unveiling of groundbreaking innovations set to redefine the tech landscape. Among the predictions, mobile phones with AI capability take center stage, heralding a new era of personalized experiences and seamless integration.

At the upcoming 2024 Mobile World Congress, Huawei is poised to showcase its latest advancements in mobile technology, leveraging cutting-edge HiSilicon processors and advanced process nodes.