This report is a Memory Floorplan Analysis (MFR) of the embedded flash memory on the Renesas R7F702301B die found inside Renesas R7F702301BEBBA-C.

Despite growth slowing as the subscription video on demand (SVOD) market matures and the COVID bump dissipates, SVOD services are on track to net an additional 82M subscribers in 2023, up 6% YoY.

This is a device essentials folder (DEF) of Sony IMX591, 10.1 µm pixel pitch, stacked back-illuminated direct-Time of Flight (d-ToF) SPAD sensor, extracted from the Apple iPhone 15 Pro Max LiDAR camera.

TechInsights has uncovered the world's most advanced 3D NAND memory chip in a consumer device, a surprise achievement from China's YMTC, a top 3D NAND manufacturer. This chip is crucial for high-performance computing, especially in AI and machine learning, and marks a significant leap in technology, being the first quad-level cell (QLC) 3D NAND die with over two hundred active word lines detected by TechInsights.

Speakers at the Move America 2023 conference expressed an urgency to establish more reliable public charging for advancing all transportation modes.

Global refurbished handset sales volumes are growing at a healthy pace in 2023 and will continue to grow through the next several years.

The Ring Bridge 5C28S8 is a LoRa hub which controls Ring lights, doorbells and Ring cameras that are connected to same network in the one Ring App. If one Ring device detects motion, it can turn on lights, activate cameras, and connect to Alexa-enabled devices.

The Device Essentials Plus analysis of Samsung's S5KHP2S, a 200 MP, 0.60 μm Pixel Pitch, Back-Illuminated CMOS Image Sensor found inside the Galaxy S23 Ultra rear wide-angle camera.

Interested in all things emerging and embedded memory? Don’t miss this video series featuring Dr. Jeongdong Choe.

The Chip Insider®