Recently, TechInsights hosted a webinar where several experts from our Logic, Image Sensor, Memory, and Engineering teams reviewed applications of hybrid bonding technology and discussed what’s to come in 2023 and beyond.
Leading market and technology analysts from TechInsights will be attending the Mobile World Congress (MWC) in Barcelona, Spain Feb. 27 – Mar. 2, 2023. During the event, our analysts will conduct business meetings, moderate conference sessions, attend briefings and provide media interviews.
This short-form video series will cover topical events and include insightful commentary from our TechInsight’s experts (and surprise guests) on how powerful this tiny object is.
Advanced lithography techniques, which are required to print ultrafine features on to chips, are primary enablers of modern technology advancement. There are many different lithographic techniques, with EUV considered the modern-day frontrunner leading the way to the world’s most advanced chips.
CMOS image sensors (CIS) have continued to evolve in response to performance requirements of current applications of Smartphone Imaging, Security Surveillance, Biometrics, Automotive and Depth Sensing and Ranging.
Apple’s annual big reveal in September 2022 promised an iPhone 14 with “a re-engineered proximity sensor”, detecting light from behind the display to save additional space. This is the type of announcement the CIS subscription likes to hear about, and indeed our initial teardown analysis showed that Apple decided to change their approach to the proximity sensor.
The innovation seen within smartphones, including increasingly faster charging speed, has been exciting to watch over the past year. Key players like Xiaomi, Realme, Samsung, and Black Shark are leading the pack in this space with Xiaomi and Realme as the top competitors, surpassing 100 W.
The memory technology landscape is continuously evolving. DRAM and NAND Flash memory demands have been steadily increasing and emerging memory markets such as STT-MRAM, ReRAM, PCRAM, FeRAM, and 3D XPoint memory are expected to reach $36 billion by 2030. As emerging memory makers race ahead of device scaling, they will face several challenges.
"It was a busy year in the IoT connectivity landscape in 2022. TechInsights’ team of subject-matter experts and analysts worked hard at identifying the key events, technologies, and design practices to include in our IoT SoC subscription."
TechInsights ran a comparison of the YMTC 232-L against 128- and 176- layer solutions from Samsung, SK hynix, and Micron, looking at factors like die size, bit density, active layers, word line pitch, and more.
Logic Blog A Trip Down TSMC Memory Lane – Part 2 Dick James To start Part 2 of the blog, we backtrack to 1998, when the 0.25-µm process was launched. One of the comments from Shang-Yi Chiang’s (former VP of R&D at TSMC) oral history was that when he
Mobile RF Blog Mobile RF Year in Review - Who Made Our Top Picks for 2022? 2022 has been a busy year in the mobile RF landscape. TechInsights’ team of subject- matter experts and analysts have been hard at work identifying the key events
