Latest Blogs and Commentary
2025-12-08 - Test Connectivity Q3 Update and Outlook
Third quarter update: forecast for the next 5 years for Probe cards, Test and Burn-in Sockets and Device Interface boards.
Narrative: Smartphone Fingerprint Sensor Market Share Q3 2025
Smartphone fingerprint sensor market grew 25% in Q3 2025, driven by FoD tech, OLED adoption; Qualcomm leads, followed by Goodix and Egis.
Narrative: DRAM Market Report Q4 2025
Q3 2025 DRAM market update with short- and long-term outlooks plus deep dive into current industry dynamics.
System Carbon Module User Guide
Step-by-step guide to upload BOM, create scenarios, and analyze carbon emissions in TechInsights’ System Carbon Module.
Tracker: Global Fitness Band Vendor Market Share by Region Q3 2025
Global fitness band shipments surged in Q3 2025 for the fourth straight quarter, driven by demand growth in China and consumers desire for simpler devices.
McClean Report December 2025: M&A Overview
A strategic shift toward AI-focused capabilities pushed the highest level of Semiconductor M&A activity since 2021
Summary - Fibocom SCA825-W AI Smart Module Deep Dive Teardown
AI IoT module powered by Qualcomm QCS8250, with detailed teardown and cost analysis from TechInsights.
Amazon Echo Show 21 Teardown: High-Level Cost and Design Insights
A high-level teardown overview of the Amazon Echo Show 21, highlighting design trends, cost contributors, and connectivity upgrades. Full deep dive available free on the TechInsights Platform.
Summary - Solos AirGo V Kripton 2 (TPM-S00V) Deep Dive Teardown
AI-powered smartglasses with GPT-40 assistant, translation, and advanced teardown insights from TechInsights.
SMIC N+3 Confirmed: Kirin 9030 Analysis Reveals How Close SMIC Is to 5nm
Our Kirin 9030 analysis confirms SMIC’s N+3 node and reveals how it compares to industry 5nm. Get process measurements, density benchmarks, and expert analysis.
The Chip Insider®–SEMI ITPC Highlights and Notables
SEMI ITPC: ASML pushes EUV cost cuts & new packaging tools; Intel bets on power tech & culture shift; Samsung, SK hynix eye custom HBM; AWS flags heat & optical fixes.
Apple A19 Pro SoC (TSMC N3P) Floorplan Analysis
The Apple iPhone 17 Pro and Pro Max contain the Apple A19 Pro APL1V12 SoC, which features the TMUA28 die.
2025 Sensors - Circuit Analysis Report Briefing 1
The Circuit Analysis Report (CAR) briefing provides examination of ISP devices profiled and details the learnings of ISP circuit technology & marketing trends of the overall ISP space.
KIOXIA FYK8_1T 218L BiCS8 1 Tb QLC 3D NAND Internal Waveform Analysis
This report provides an analysis of the program, read and erase waveforms for the KIOXIA FYK8_1T 218L 1Tb QLC 3D NAND device found on the Kingston SNV3SM3/2T0 SSD.
Summary - Apple iPhone 17 A3521 Deep Dive Teardown
iPhone 17 A3521 Deep Dive: teardown analysis with design, cost, and benchmarking insights in a detailed, graphics-rich report.
Samsung Galaxy Watch 8 Pop Advanced Packaging Quick Look
Samsung L505F: 64GB storage, 2GB memory, penta-core CPU (1.6GHz), Exynos W1000, and Galaxy Watch 8 sensors like heart rate, gyro, and temperature.
5 Expectations for the PC/Laptop/Tablet Market in 2026
Join TechInsights on Dec 9/10, 2025, for a free webinar exploring five key trends in PCs, laptops, and tablets for 2026, including on-device AI, tariffs, mid-market opportunities, and processor innovations.
The AI Carbon Challenge: Why Your Next GPU's Memory Stack Is the New Emissions Hotspot
AI GPU production will account for 8.7% of all semiconductor sector emissions by 2030. The Global AI GPU Manufacture Carbon Emissions Forecast, 2026-2030, contains the critical data and strategic insights needed to navigate this accelerating environmental transition.