Read the latest analysis on AMD’s Ryzen 7 9800X3D, Intel’s Twin Lake CPUs, and the rise of AI in edge technologies, along with key takeaways from CES 2025.
Twin Lake-N is intended for low-power, budget-conscious designs, offering only single-threaded Gracemont E-cores first found in Alder Lake processors. True to the name, Twin Lake-N bears striking similarities to its Alder Lake-N predecessors.
Examine the impact of mature node chip overcapacity, price collapses, and global market implications. Learn how this shapes the semiconductor industry.
Dive into the latest Microprocessor Report highlights: MediaTek Dimensity 9400 analysis, NPU advancements for edge IoT, Intel CEO Pat Gelsinger's retirement, and key takeaways from the 70th IEEE IEDM event.
Learn how AI and Arm architecture reshaped the PC processor market in 2024, driven by Microsoft's Windows on Arm progress and advanced AI engines in the latest devices.
Discover how Wi-Fi sensing leverages signal disturbances for motion detection without cameras. Learn about its privacy-friendly, cost-effective applications and the role of Wi-Fi SoCs in enabling this innovative technology.
Discover Altera's Agilex 3 FPGAs, designed for edge applications with AI capabilities, high-speed transceivers, and advanced architecture. Learn how they redefine performance and efficiency.
Explore how high-bandwidth memory (HBM) is revolutionizing graphics, HPC, and AI but facing production challenges that drive up costs and delay AI accelerator shipments.
Discover Ampere Computing’s AmpereOne architecture, a custom Arm-compatible CPU built for cloud datacenters, maximizing efficiency, scalability, and performance per watt with up to 192 cores and advanced cache designs.
Explore the September 2024 review of the Microprocessor Report, highlighting new IP from Ceva and Movellus, Tenstorrent's AI toolkit, and key foundry updates like Intel's 20A cancellation and TSMC's AI design tool certification.
CXL stands out from a mix of interconnect standards, providing a way to connect memory to various processing elements and share memory resources within a data center. The latest to join the CXL 2.0 party is Marvell, which recently unveiled the Structera product line.
It’s still early days for the AI PC, where AI workloads are being run in roughly equal proportion on NPUs, GPUs, and CPUs. But in the not so distant future, we expect NPUs to take on the lion’s share of AI workloads in the AI PC.
Explore insights from Hot Chips on AMD, Mindgrove, Intel's 3 process with TSVs for Xeon 6, and new datacenter products from IBM, Ampere, Microsoft, and Furiosa, highlighting the growing traction for RISC-V.
