Featured Report Analysis
Insight: Qualcomm Elevates Wearables with Wear Elite Platform
Qualcomm Snapdragon boosts wearables capabilities with AI-driven features, richer sensors, multiple connectivity options and faster charging times.
Microprocessor Report February 2026 Review
Microprocessor Report February 2026 features Intel’s Panther Lake, Rebellions’ REBEL‑Quad, Snapdragon 8 Gen5 Elite and 8Gen5, and a 2025 retrospective on major developments.
Semiconductor Analytics – March 11, 2026
Weekly semiconductor sales stay flat but rise YoY, with NAND’s 13‑week average improving as the platform tracks trends across key semiconductor segments.
Narrative: NAND Market Report Q1 2026
Q1 2026 NAND report tracks a dramatic pricing inflection, as AI datacenter demand and tight wafer supply reshape revenues, margins, and demand mix.
Video: NAND Market Report Q1 2026
This recorded presentation walks through NAND market data, highlighting supply trends, demand shifts, pricing moves, and technology advances.
March 2026 Sensors Newsletter
March 2026 newsletter includes RoboSense EM4, GalaxyCore GC50F6, Sony IMX914 and two SmartSens 50 MP sensors from the Huawei Mate 80 series phones.
March 2026 Connectivity Newsletter
March 2026 Connectivity Newsletter includes Huawei Mate 80 RS, Qorvo Tuner, Samsung S6575, and Silicon Labs SiMG301.
Insight: NXP Combines 48V and Zonal ECUs Into a Single Pre‑Validated Stack
NXP’s CoreRide Z248 is a 48V zonal ECU reference system built on S32K5, combining power, data, and software to speed zonal E/E adoption.
The 4F² Breakthrough: VCT DRAM and the Hybrid Bonding Era for sub-10nm DRAM
DRAM and 3D NAND move beyond planar scaling as vertical integration and hybrid bonding take lead, with VCT‑based 4F² DRAM being key to the transformation.
Insight: MIPS and Green Hills Software Announce Safety SDK for RISC-V Automotive MCU
MIPS and Green Hills launch a Safety SDK pairing Atlas M8500 with certified tools, targeting ASIL‑D/SIL safety for automotive power and control systems.
Narrative: DRAM Market Report Q1 2026
DRAM market update focuses on Q4 2025 results, current market dynamics, near and long‑term industry outlooks.
Video: DRAM Market Report Q1 2026
DRAM market update reviews Q4 2025 results, current dynamics, and near‑ to long‑term outlook shaping memory industry trends.
Analysis: The Evolving U.S. Tariff Regime and Its Implications for the Semiconductor Industry
TechInsights reviews shifts in U.S. tariff policy after a Supreme Court ruling ends IEEPA tariffs and new trade actions are proposed under other laws.
Narrative: AI Datacenter Optical Interconnects 2025-2030 – The $84B Race to the 3.2-Terabit Era
This narrative updates AI datacenter optics forecasts, covering the shift to 1.6T and 3.2T, CPO adoption, and changes across vendors and supply chains.
Insight: Has the Time Come for SiC Industry Consolidation?
SiC power competition intensifies across Japan, China, and the West, as this insight maps today’s landscape and what it signals for near‑term market shifts.
Narrative: Smartphone Fingerprint Sensor Market Share Q4 2025
Smartphone fingerprint sensors post 10%+ YoY growth in Q4 2025, led by ultrasonic and optical demand, with Qualcomm, Goodix, and Egis on top.
STMicroelectronics Launches the Fully Integrated UWB Solution with IEEE 802.15.4z and 4ab Standards
ST launches the ST64UWB chip family after MWC 2026, using AI and 18 nm FD‑SOI to integrate IEEE 802.15.4z and 4ab UWB standards.
Analysis: Can China even build data center AI chips?
SMIC runs Kirin 9030 on its N+3 node using DUV, proving scaled mobile logic, but limits make it unsuitable for large data center AI chips.