Explore the latest advancements in 3D NAND technology with our comparison of multi-layer products from Samsung, SK hynix, Micron, and YMTC. Understand how Vertical Cell Efficiency (VCE) impacts performance and discover which manufacturers lead in this crucial metric.
In his keynote at Computex 2024 last week, Jensen Huang proclaimed to a cheering crowd, “We are in a new Industrial Revolution.” But his grand strategy is far more encompassing than the vision of the AI Revolution.
In this briefing, foundries and process nodes used to fabricate the devices are identified, and floorplan and layout are discussed including the area allocated to the analog to digital converters, digital processing, and embedded SRAM.
Interest in Windows on Arm (WoA) is at a high point. Microsoft and Arm must take the opportunity to plug the remaining gaps and create a broader WoA ecosystem.
Taiwan's ambitious net-zero emissions goal by 2050 faces challenges due to limited resources, high tech sector demands, reliance on imported fuels, and a contentious energy debate, despite significant gains in renewable energy.
The Apple Vision Pro headset introduces a new level of immersive computing through "spatial computing," merging virtual widgets with your real-world environment.
Innovative PVDF/Al2O3 Separator Boosts Amazon Echo Frame 3rd Gen Battery Safety Discover how the Amazon Echo Frame 3rd Gen achieves high energy density and enhanced safety with its innovative PVDF/Al2O3 battery separator. Learn about the design
Discover how ODM sales are soaring as hyperscalers and cloud providers like AWS and Google go direct, reshaping the server market with custom silicon and hybrid cloud strategies.
Discover how ongoing NVIDIA shortages are driving the need for custom silicon in cloud computing. Explore the benefits and future implications of proprietary chips from AWS, Microsoft, Alibaba, and Google in a rapidly evolving market.
This briefing delves into the latest developments in emerging non-volatile memories (EM), encompassing products, technology trends, comparisons, and opportunities for devices like STT-MRAM, PCRAM, ReRAM/CBRAM, and FeRAM. It also covers the technology roadmaps and challenges faced by leading EM foundries.
Processor companies are packing more neural processing capability into processors for IoT edge devices. Here’s a look back at several of these that we covered in May.
Meta’s Reality Labs discussed a prototype AR processor at the 2024 ISSCC, fabricated using hybrid bonding as 3D packaging. This improved performance for the trial tasks of hand tracking and image processing.
Discover the latest advancements in DRAM technology as of Q2 2024, including updates on EUV lithography, HKMG processes, and emerging 3D DRAM developments from industry leaders like Samsung, SK hynix, and Micron.
Discover the latest advancements in 3D NAND technology with our Q2 2024 Memory Technology Roadmap update. Learn about Samsung, KIOXIA, Micron, SK hynix, and YMTC's newest innovations and upcoming products.
Discover the latest in AI and tech with Chip Observer May 2024. Highlights include NVIDIA's Blackwell chip, Intel's Gaudi 3, Apple's M4, new AI tools, and significant geopolitical and funding updates.
