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MFR delivers a clear view of device floorplans, combining advanced imaging with process‑node, functional blocks, and die‑to‑package cost analysis.

A Memory Floorplan Report (MFR) delivers a detailed analysis of a device’s floorplan architecture, supported by optical, X-ray, SEM cross-sectional, and SEM bevel imaging. The report includes an executive summary of key findings along with process-node and foundry identification, critical dimension measurements, and breakdowns of memory and peripheral functional blocks. In addition, the MFR provides die and package cost analysis, enabling a comprehensive understanding of the device’s design strategy and manufacturing economics.