Explore the Broadcom BCM4390Y die found in the USI G6-602650 Wi-Fi 7/BT 5.4 Combo SoC.
The Broadcom BCM4390Y die found inside the USI G6-602650 Wi-Fi 7/BT 5.4 Combo SoC. The Universal Scientific Inductrial (USI) G6-602650 Wi-Fi 7/BT 5.4 Combo SoC was extracted from the Google Pixel 9 5G smartphone.
Insights On-Demand Webinar Series: Navigating the Future of Semiconductors
Stay ahead in the fast-evolving semiconductor industry with our Insights On-Demand Webinar Series!
Chips, China, and Consequences: Navigating the Impact of Trump's Technology Tariffs
Explore how U.S. technology tariffs are reshaping global chip markets in Chips, China, and Consequences, an exclusive TechInsights eBook. Available only on the TechInsights Platform.
Maximize Wafer Efficiency with TechInsights’ Die Calculator
The Die Calculator from TechInsights empowers engineers, procurement specialists, and finance teams with the insights they need to understand die utilization and yield with confidence.
Earth Day 2025: A Progress Report on Sustainable Semiconductor Manufacturing
Can the chip industry scale innovation and sustainability? Discover the current state of green tech in one of the world’s most energy-intensive sectors.
