2 Min Read May 30, 2025
A Basic Floorplan Analysis of the Bestechnic BT2007P RF transceiver die, integrated within the Bestechnic BES2610WE Combo Wi-Fi 6 / Bluetooth 5.4 module. The BES2610WE component was sourced from an HONOR Magic7 Pro smartphone.
Google Pixel 9a Teardown: Tensor G4 Processor and Cost Analysis
Explore the Google Pixel 9a teardown revealing the Tensor G4 processor, memory, display, and camera cost structure. See how it compares to the iPhone 16e A3212. Access full details on the TechInsights Platform.
Impact of US-EU Tariff Threat on the Computing Market
Discover how Trump’s proposed 50% EU tariffs affect the computing market. TechInsights explains why economic uncertainty poses a bigger risk than direct supply impacts.
Taiwan’s Export Curbs on Huawei, SMIC: Semiconductor Impact
Taiwan’s export restrictions on Huawei and SMIC signal major shifts in the semiconductor industry, affecting supply chains, foundry strategies, and market trends.
