We are also eagerly anticipating the arrival of the SK hynix 96L 3D NAND solution.

Technology Professionals

We are excited to examine the different approaches of each manufacturer, and to provide the level of competitive analysis you require, from product-level teardown and bill-of-materials analysis to detailed die-level structural, process, and circuit information.

Intellectual Property Professionals

A successful IP strategy in this field requires an awareness of disruptive events in NAND, knowledge of key and upcoming market players, and the correct application of reverse engineering techniques to identify the changes from generation to generation of the latest NAND technology. Our analysis enables fact-based IP decisions in support of licensing, defense, acquisition, divestiture, and prosecution projects, and includes everything from product-level teardown and bill-of-materials analysis to detailed die-level structural, process, and circuit information.