Newsroom

Posted: May 2, 2017 Contributing Authors: Dick James, Fellow Emeritus During the ISSCC conference last February, Sony issued a press release describing “Industry's First 3-Layer Stacked CMOS Image Sensor with DRAM for Smartphones” . There have been rumours of image sensors with embedded DRAM (to

Posted: April 26, 2017 The Qualcomm Snapdragon 835 applications processor found in the Samsung Galaxy S8 is confirmed to be built on Samsung’s 10 nm LPE process. Debut devices for the 10 nm LPE are the Qualcomm Snapdragon 835 and the Samsung Exynos 9 application processors. We have started our

Posted: April 24, 2017 Contributing Authors: Andy Wei With the first set of Samsung Galaxy S8 teardowns , we have access now to the first SoCs produced on “10 nm” class technology. First to the 10 nm productization finish line is the Qualcomm Snapdragon 835, built on Samsung LSI Foundry’s 10 nm LPE

Posted: April 20, 2017 Qualcomm WTR5975 Gigabit LTE Transceiver The WTR5975 is a member of the Snapdragon 835 family found in the Samsung Galaxy S8 and is the world’s first single-chip RF IC supporting Gigabit Class LTE, LTE-U, and LAA with 5 GHz unlicensed band support. The highly integrated

Posted: April 7, 2017, Updated: April 25, 2017 We are excited to announce receipt of our Galaxy S8. Our blog details teardown findings including cost observations, verification of the 10 nm LPE process, commentary on the Qualcomm WTR5975 Gigabit LTE Transceiver and envelope tracking power supplies,

Posted: March 3, 2017, Updated: April 24, 2017 Nintendo Switch Packaging Friday was a big day for Nintendo, and indeed the gaming community as a whole, with the launch of the new and innovative console-tablet hybrid, the Nintendo Switch. For consumers lucky enough to get their hands on this new

Posted: February 10, 2017 Contributing Authors: Ray Angers, Goran Grbic and Martin Bijman Microsoft recently launched a new service to their cloud customers offering protection against patent infringement lawsuits. TechInsights was given early access to the patents being made available to Microsoft

Posted: January 20, 2017 Apple W1 343S00131 Bluetooth Module The W1 chip found in the Beats Studio wireless headphone has the package mark 343S00131. Meanwhile, the W1 chip torn down from the Apple AirPods has the package mark 343S00130. They have a slight difference in the last digit in the package

Posted: January 20, 2017 Contributing Authors: Jim Morrison and Daniel Yang The AirPods were announced back in September of 2016 and our analysis team at TechInsights had eagerly anticipated them to be for sale in October. However, October and November came and went and still no AirPods and no real

Posted: October 27, 2016 Contributing Authors: Dick James Recently Google launched their Pixel phone with great fanfare and media response. This is the first phone for which Google designed the hardware, software, and cloud ecosystem, as opposed to the Google Nexus phones, which used the Android

Posted: October 17, 2016 Contributing Authors: Dick James One of the lesser-known stories of mobile phone evolution is the development of proximity sensing in order to save power and disable touch screen functions when the phone is actually being used as a phone. This essentially means turning off

Posted: October 12, 2016 Contributing Authors: John Sullivan UPDATE October 27th 2016: Today Qualcomm announced a definitive agreement to purchase NXP . This acquisition instantly positions Qualcomm highly in the automotive market, in direct competition with Texas Instruments (rumoured to be amongst