A Guide to Processors for Deep Learning
Covers processors for accelerating deep learning, neural networks, and vision processing for AI training and inference in data centers, autonomous vehicles, and client devices.
Supporting IP strategy in the semiconductor industry
Supporting IP strategy in the semiconductor industry Growing complexity of the chip market has made it harder than ever for intellectual property owners to monitor developments, making reverse engineering a crucial process The breadth of reverse engineering required to innovate, protect and monetise
Sony d-ToF Sensor found in Apple’s new LiDAR camera
January 19, 2021 Image Sensor Disruptive Technology Sony d-ToF Sensor found in Apple’s new LiDAR camera Apple’s LiDAR camera was first observed in 2020’s iPad Pro; as expected, we saw that same part used in the iPhone 12 Pro in October. Industry experts expect that this part will be in use for the
HiSilicon’s move towards an antenna to modem solution - Mobile RF TechStream Blog
January 12, 2021 John Sullivan HiSilicon’s move towards an antenna to modem solution HiSilicon provides the RF transceiver and mobile SoC for Huawei’s mobile handsets but the RF front end has traditionally been sourced from the usual front end suppliers such as Skyworks, Qorvo and Murata among
Intel Launches 2nd-Gen 3D XPoint Memory, Discusses at IEDM - Memory TechStream Blog
December 28, 2020 Dick James Intel Launches 2nd-Gen 3D XPoint Memory, Discusses at IEDM On Dec 16th Intel held a "Memory & Storage Moment"" where they announced five new memory and storage products; two Optane™ SSDs, one for data centers, and one aimed at PCs, and three 144-layer 3D-NAND SSDs (solid
Toshiba Integrated Diode into SiC MOSFET - Power TechStream Blog
December 21, 2020 Stephen Russell Toshiba Integrated Diode into SiC MOSFET Every silicon carbide (SiC) manufacturer seemingly has their own approach to FET fabrication. Be it planar, trench, JFET, etc. there is no dominant design throughout the market. Toshiba’s recently released 2nd generation 1200
Analysis of Apple M1 is Happening – and, Thermal Imaging?
Dick James, Fellow Emeritus Dick James is an almost 50-year veteran of the semiconductor industry, working in the process development, design, manufacturing, packaging and reverse engineering of semiconductor devices. Dick is a regular contributor to TechStream blog content for subscribers. December
Webinar: Increasing Value of Semiconductor IP in the Automotive Supply Chain
Increasing Value of Semiconductor IP in the Automotive Supply Chain Today, automobiles are more than just transportation devices. Automobiles are hotspots with entertainment systems, state of the art communications capabilities, and cutting edge displays that do far more than navigation. Consumers
Two new Apple SoCs, two market events: Apple A14 and M1
Available Logic Subscriptions > Process & Advanced Packaging > Process Flows > Transistor Characterization > SoC Design Analysis > Digital Floorplan Analysis > Analytics - Digital Floorplan > Standard Cell GDS Library Analysis > Transistor Architecture Comparison > Interconnect and Patterning
Teardown: Velodyne Lidar Puck VLP-16 sensor (Electronics360)
A deep dive into the major components used in the light detection and ranging technology. Posted in Electronics360.
Webinar: Emerging GaN Technology in USB-C Power Delivery Adapters
Emerging GaN Technology in USB-C Power Delivery Adapters This event was presented by Sinjin Dixon-Warren & TechInsights Power adapters with a USB connection are ubiquitous in modern life. The wonderful mobile devices we use require regular connection to grid power, generally through a USB adapter
