Latest Blogs and Commentary
onsemi NVH4L022N120M3S Automotive M3S EliteSiC 1200V, 22mOhm N-Channel SiC Power MOSFET Power Essentials Analysis
This is a Power Essential Analysis (PEF) of the onsemi NVH4L022N120M3S device of the M3S family. The NVH4L022N120M3S EliteSiC is a 1200 V, single N-channel enhancement-mode silicon carbide-based power MOSFET.
Broadcom BCM4398 Wi-Fi 7/BT 5.2 Combo SoC Floorplan Analysis (IoTB)
This report is a Basic Floorplan Analysis (BFR) of the Broadcom BCM4398 die found inside the Universal Scientific Industrial G5-602550 component. The BCM4398 die was manufactured on 300 mm wafers using TSMC's 7 nm HKMG finFET CMOS process.
Microsoft Closes $69 Billion Acquisition of Activision Blizzard
Concluding 20 months of an often-contentious approval process with regulators in the US, EU, UK, and New Zealand, including defeating the Federal Trade Commission in a US federal court and restructuring the deal to appease the Competition and Markets Authority (CMA) in the UK, Microsoft closed its acquisition of Activision Blizzard, publisher of Call of Duty, World of Warcraft, and Diablo. This report examines the implications of this merger.
Global Smartphone Market Stabilized with 0.3% Annual Decline in Q3 2023
Global smartphone shipments went down -0.3% YoY at 296 million units in Q3 2023. It is notable that the annual decline rate has largely stabilized / improved from previous quarters, indicating the bottom might have already reached, and a mild rebound is expected in 2024.
VR Headset Forecast by Device Type 2014-2028 3Q 2023
TechInsights expects the VR headset market to be worth just under $8 billion and grow to an installed base of 37 million units by 2028.
VR Headset Forecast by Price Tier 2014-2028 3Q 2023
TechInsights expects the VR headset market to be worth just under $8 billion and grow to an installed base of 37 million units by 2028.
HiSilicon Hi1105GFCV120 Wi-Fi 6/BT 5.2/SparkLink SoC Floorplan Analysis (IoTB)
This is a Basic Floorplan Analysis (BFR) of the HiSilicon Hi1105GFCV120 Wi-Fi 6/BT 5.2/Sparklink SoC. The Hi1105GFCV120 package contains one silicon die (the RF Transceiver) devoid of any salient markings, flip-chip mounted on a printed wiring board (PWB) in a 274 pin FPGA package.
AI: Product or Foundational Technology?
The Chip Insider® - As you know, McKinsey has talked up how huge the AI market will be in the future. They project it could be on a scale of trillions of dollars with the high end matching the GDP of today’s Germany ($4.4T).
Cadence Upgrades DSPs To LX8
Cadence has updated its DSPs to use the latest platform while making further improvements to two audio and two vision models.
Axelera Offers 210 TOPS For The Edge
Axelera’s Metis AI accelerator achieves over 200 TOPS using digital in-memory computing for high-end edge applications. Typical power is less than 10 W; module pricing is below that of incumbents.
Global Foldable Display Smartphone Vendor Market Share by Design Type: Q3 2023
Samsung was the leader in foldable display smartphone shipments in Q3 2023, followed by Huawei and Motorola. Shipments grew YoY but major markets North America and Western Europe declined heavily ongoing geopolitical and economic turbulence and Samsung's softness.
Global Foldable Display Smartphone Vendor Market Share by Region: Q3 2023
Samsung was the leader in foldable display smartphone shipments in Q3 2023, followed by Huawei and Motorola. Shipments grew YoY but major markets North America and Western Europe declined heavily ongoing geopolitical and economic turbulence and Samsung's softness.
Global MacBook Shipments by Model: 3Q 2023 Results
Apple has not been immune to the lull in demand and macroeconomic woes that have plagued the notebook PC industry following the COVID-19 era. In 2023, Apple's MacBook shipments are expected to decline 18% from their height in 2022 (24.7 million units).
Reticles Forecast: Latest Updates
The latest update of the Reticle Forecast covers yearly reticle sales, shipments, average selling prices, and reticle shipments by stepper type through 2027.
TechInsights' Semiconductor Analytics Report
TechInsights' Semiconductor Analytics Report
IBC 2023: AI Takes Center Stage
After making a post-COVID comeback in 2022, the International Broadcasters Conference (IBC) was back at the RAI Amsterdam September 15th to 18th, showcasing numerous product announcements and highlighting emerging broadcast and video industry trends.
Automotive Cyber Security Software Vendors and Solutions – 2023 Update
The automotive cyber security market has changed over the last few years as automakers, and their suppliers, adapt their operations and products to comply with regulations set to go into effect in Europe in 2024 and in other countries in the future.
Global Device Imaging Enablers Forecast to 2028
Imaging in one of the most important features in a modern handset and vendors continue developing the imaging experience further. Today camera phones have effectively replaced standalone pocket cameras.