How long can Sony keep the top spot in the image sensor market?
Not long ago, Yuanta Research released market data on global CIS (CMOS image sensor), pointing out that its overall market size is still growing rapidly.
Qualcomm QTM052 mmWave Antenna Module
Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges associated with the use of mmWave componentry, because of
NAND technology: Open the gates
In the $60bn NAND tech market, patent landscape analysis can give companies the edge, as Martin Bijman and Trevor Izsak of TechInsights explain.
Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign
At its heart, an assertion campaign relies on Evidence of Use (EoU), to demonstrate the existence of ongoing infringement. If no one is using the technology covered by your patent portfolio then your patents are not as valuable. Conversely, when there is EoU the value of a patent portfolio is greater.
Electric Cars Gain Traction, But Challenges Remain
(Semiconductor Engineering) Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption in the market.
TechInsights memory technology update from IEDM18
Posted: April 11, 2019 Contributing Author: Dick James, Jeongdong Choe On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees. Arabinda was first up, giving a talk on the “10
9X Layer 3D NAND Analysis
Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L 3D FG/PUC NAND Flash We are also eagerly
Samsung Galaxy S10 5G Teardown
Posted: April 9, 2019 Contributing Author: Daniel Yang & Stacy Wegner It’s here. It’s in our labs... Two major 5G events happened last week: Verizon launched their 5G network in Chicago, and on the other side of the globe, Samsung launched the world’s first 5G mobile handset in Korea - the Samsung
Analyzing innovations in mobile radio frequency front-end integration
Posted: April 09, 2019 The mobile RF front-end architectures of 3G and early 4G smartphones were relatively simple and could be built from discrete components. The mobile radio frequency (RF) front-end today has become much more complex to support the evolving LTE standard. Smartphones need to
Webinar: High-Density Fan-Out Package Technologies – Examination and Comparison
Originally Presented: April 9, 2019 / 2:00pm to 3:00pm ET Hosted By: Michel Roy Low-density fan-out package technology has been around for more than a decade. Due to limitations in RDL counts and capabilities in line space / line width, this technology has traditionally been used in low-to-medium
3D NAND Metrology Challenges Growing
(Semiconductor Engineering) The big challenge is to characterize the inner portions of a 3D NAND device, which consists of complex materials, multiple layers and tiny channel holes. Then, as you add more layers, the metrology challenges increase “due to a higher number of 3D gate stacks and multi
