Latest Blogs and Commentary
Summary - Seyond Robin E1X (LP-LIDAR080-BA) LiDAR Deep Dive Teardown
Summary report on the Seyond Robin E1X, a compact automotive-grade semi‑solid‑state LiDAR sensor.
Decode Competitive Image Sensor Design | Pixels & Stacking
Decode competitive image sensor design with real teardown data. Compare pixel designs, stacked image sensors, and innovations that reached production.
Tracker: Global Smartwatch Vendor and OS Value Share by Price-Tier Q3 2025
Global smartwatch revenues rose 4.7% YoY in Q3 2025. Apple is the dominant player in terms of smartwatch revenue share, capturing more than 50% of global smartwatch revenue.
Memory Pricing Report January 2026
Track volatile DRAM and NAND trends with three‑month pricing insights and forward forecasts across all major memory types.
Analysis: CES 2026 - AI, Interoperability, and Embodied Intelligence Reshape the Smart Home
Explore TechInsights’ key findings from CES 2026 related to edge AI, sensor technologies, and more from companies like Amazon, ADT, and Qualcomm.
Analysis: Vera Rubin Power Budget
A look into the power budget and semiconductor industry considerations for Vera Rubin AI platform.
Semiconductor Analytics - January 22, 2026
DRAM and NAND prices surge as tight supply and strong AI demand push memory markets higher across all major product categories.
2026-01-22 - Critical Subsystems Graphics.xlsx
Comprehensive supply chain data tracks equipment trends, inventories, fab utilization, and chip pricing for a full view of semiconductor dynamics.
Analysis: CES 2026 Wearables: AI, Computer Vision, and Health Tracking Take Center Stage
Discover key wearables trends from CES 2026, where smartglasses, AI-powered devices, smart rings, and digital health innovations took main stage the Las Vegas show floor.
Summary - Cosmo JrTrack5 JRTV5 Deep Dive Teardown
A deep dive teardown of the Cosmo JrTrack5 JRTV5, a cellular-enabled smartwatch.
Summary - Amazon Ring Wired Doorbell Pro 4K (5DFYA2) Deep Dive Teardown
A deep dive teardown into the Amazon Ring Wired Doorbell Pro 4K (Third Gen).
5 Expectations for the Mobile Market in 2026
AI-driven mobile experiences, SoC innovation, and DRAM integration- what’s next for the mobile market.
Insight: Honda 0, Afeela May Share More Than Thought, But How Much?
Afeela 1 and Honda 0 reveal shared hardware and E/E foundations, strengthening Sony Honda Mobility’s path to scalable EV launches.
Analysis: Utilization Rises and New Capacity Is Planned
AI demand keeps 8‑inch foundries running hot, setting up tighter supply and potential power and analog price gains in 2026.
Decode Hyperscaler Architectures | Hyperscale AI & Cloud Silicon Analysis
Understand how hyperscalers architect compute for AI and HPC. Access teardown-backed silicon insights into hyperscale architectures, packaging, and performance trade-offs.
Industry Performance (TCI Graphics) – January 15, 2026
Discover how surging prices and low supplies impact AI infrastructure demand. Access weekly, monthly, and yearly data to enhance supply chain management.
Analysis: CES 2026: Three Key Trends and Few Announcements
CES 2026 marked a significant return for smartphones, with major brands, chipmakers, memory suppliers, and ecosystem partners participating at the show.
Wafer Demand Forecast Overview: Q4 2025 Update
Global silicon wafer demand is expected to surge nearly 7% in 2026, driven by AI infrastructure growth and rising need for GPUs.