Capital Equipment

Advanced Packaging​

The Advanced Packaging coverage helps you understand all aspects of advanced logic technologies, gain visibility into the competition’s historical – and anticipated – approach, and make better next-node technology choices.

• Competitor Analysis
• Data Visualization
• Inquiry Privileges
• Insight Reports
• Packaging

CMRS Forecast Pro

CMRS Forecast Pro provides critical datasets for semiconductors, silicon, packaging, designs and reticles along with semiconductor inventories, capacity and supply-demand analysis.

• Data Visualization
• Demand Forecasts
• Inquiry Privileges
• Market Data

Chiplets

Our Chiplets coverage tracks usage across 33 end markets and provides a breakdown of chip market research total addressable market (TAM) split between monolithic and chiplet, enabling customers to better understand the market opportunity for advanced packaging alternatives such as chiplets and to better target the highest potential TAM opportunities.

• Block Diagram
• Competitor Analysis
• Cost Analysis
• Demand Forecasts
• EE Component Usage Across Products
• Inquiry Privileges
• Market Data
• Supply Analysis
• Product Features

Device Essentials

Device Essentials provides broad coverage of the enabling technologies and pixel architectures in use in array imagers, time-of-flight (ToF), event-driven, biometric, and other optical sensors. Tactical reporting on new solutions as they come to market is augmented by curated analyst content.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Packaging
• Process

Power Essentials​

Power Essentials provides in-depth process analysis for GaN, SiC, and Si power devices, and comprehensive coverage of device metrics and salient features. Analysis includes detailed structural and material analysis using techniques such as SEM, TEM, and SCM/sMIM, covering package and die images/X-rays, SEM planview and cross-sectional images with annotated SEM-EDS material analysis conclusions, and cross-sectional TEM images with annotated TEM-EDS/EELS analysis conclusions for GaN devices, cross-sectional and planar SCM (sMIM) analysis for Si and SiC.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Process

RFIC Packaging​

Enables the comparison of various RFIC advanced packaging implementations to gain a better understanding of how they impact RF system design. This includes aspects such as DC and RF performance pertaining to module packaging, size and thermals, and heterogeneous integration. Analysis includes SEM cross-sectional and EDS materials analyses.

• Block Diagram
• High Resolution Images
• Packaging

SoC Markets

SoC Markets provides projections for IP licensing, royalty, and service revenues across various IP categories such as Memory, CPU, DSP, Graphics, Interconnect, Security, among others. Additionally, it offers insights into design initiations spanning PC/Servers, Communications, Consumer Electronics, Industrial, and Transportation sectors. A particular focus is given to the new fields of AI and RISC-V SoCs. The analysis also presents an overview of SoC silicon and software design costs across process nodes.

• Block Diagram
• Competitor Analysis
• Cost Analysis
• Data Visualization
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis
• Product Features​

Microprocessor Report

Microprocessor Report is an industry-leading weekly journal covering new Microprocessors and SoCs, providing insight into their target application and market, and differentiation from their competitive products. This will expand your access to more of the information you need to compete globally and enhance your ability to make fact-based decisions that will impact your business faster and more effectively.

• Block Diagram
• Component Price and Lead-time Trends
• Competitor Analysis
• EE Component Usage Across Products
• High Resolution Images
• IC Floorplan
• Inquiry Privileges
• Insight Reports
• Packaging
• Performance Analysis
• Process
• Product Features

Battery Cell Essentials

Battery Cell Essentials profiles the innovations impacting battery life extension, energy density, safety, cost reduction, charging speed, etc. The analysis includes materials and structural analysis (anode, cathode, electrolyte, and separator) of innovative lithium-ion battery cells found in phones, wearables, laptops, tablets, pens, and more. The analysis will also show details of the battery pack, its fit in the source device, and the components found on the battery protection control module.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Process

Battery Characterization

Battery Characterization covers cells from a range of market applications, with a focus on mobile and smaller (wearables, pens, etc.) form-factors from leading OEMs. The analysis provides insight into the thermal characteristics of devices during wireless and wired charging as well as lithium-ion battery performance during operation over a range of different conditions.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Systems

Circuit Analysis

Circuit Analysis includes hierarchical schematics, delivered in a highly interactive, easy-to-navigate environment including cross-probing to layout capability, of the active pixels, column readout, ADC, row control, ramp generator, and bandgap.

• Circuit
• Competitor Analysis
• Inquiry Privileges
• Insight Reports

Device Essentials

Device Essentials provides broad coverage of the enabling technologies and pixel architectures in use in array imagers, time-of-flight (ToF), event-driven, biometric, and other optical sensors. Tactical reporting on new solutions as they come to market is augmented by curated analyst content.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Packaging
• Process

Device Essentials Plus​

Device Essentials Plus (DEP) is an extension of SEM-based Device Essentials (DEF), performed on a subset of the annual DEF targets. DEP offers thorough structural and dopant analyses using TEM, TEM-EDS, TEM-EELS, SCM/sMIM, and SIMS analytical techniques.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Process

Image Signal Processor

Image Signal Processor content provides insights into the functional blocks and die utilization of stacked and standalone image signal processors. This content provides floorplan (functional) analysis of image signal processors (ISP) in applications such as smartphone, automotive imaging and optical sensing, computer/machine vision, edge AI, IoT, LiDAR, security/ surveillance, and more.

• Competitor Analysis
• IC Floorplan
• Inquiry Privileges
• Insight Reports

Process Flow Analysis

Process Flow Analysis provides and tabulates a listing of process steps for a better understanding of how a chip is manufactured to help identify areas for process optimization.

• Competitor Analysis
• Data Visualisation
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Process Flow

Sensors Semiconductors

The Sensors coverage area offers insights into the market share and future trends of smartphone fingerprint and image sensors. It tracks the shipments of image sensors by model, complete with detailed sensor specifications. This coverage also provides a forward-looking five-year forecast, breaking down unit shipments, revenues, and Average Selling Price (ASP) across both Imaging and 3D Sensing CMOS Image Sensor (CIS) segments. Fingerprint sensor coverage, includes shipments, revenue, and ASP and is further categorized by vendor and technology, offering a granular view of the market landscape.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data

Transceiver Floorplan​

IoT Connectivity SoC Transceiver Floorplan provides insight into competitive designs including high-level block identification, high-level process data, and manufacturing costs for leading-edge transceivers in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more.

• Competitor Analysis​
• IC Floorplan
• Inquiry Privileges
• Insight Reports

Transceiver Architecture​

IoT Connectivity SoC Transceiver Architecture coverage enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge IoT transceiver chipsets in smart home products, wearables, and routers across market leaders and disruptors over major wireless standards such as Bluetooth, Wi-Fi, NFC, UWB, and more. It includes and extends Transceiver Floorplan analyses to identify key functional blocks and the connections between them.

• Circuit
• Competitor Analysis​
• Inquiry Privileges
• Insight Reports

RF/Analog Semiconductors​

The Analog/RF coverage area offers a comprehensive view of various RF Analog markets, providing data on market share, market forecasts, die production forecasts, and financial and product news from various companies in the industry. This product encompasses a wide range of technologies, including specifics on cellular radio components used in cellular user equipment and front-end modules. It also covers Wi-Fi/Ultra-Low Power (ULP) Wi-Fi, Non-Terrestrial Networks (NTN), GaAs, GaN, and SiGe technologies.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data

Telecom Strategies​

Telecom Strategies gives you a first look at the telecom semiconductor value chain. We dive deep into Industry 4.0, future networks, edge platforms, and trends in communications and networking markets. Get competitive intel, market sizing, and forecasts across different technology sectors, all driven by the increasing demand for high-bandwidth, ultra-low-latency communication networks and services.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

AI Processor Service

AI Processor content covers hardware technologies and products from leading AI companies. It provides deep technology analysis and head-to-head product comparisons, as well as analysis of company prospects in this rapidly developing market segment. We explain which products will win designs and why. TechInsights’ AI Processor content provides a forward-looking view, helping sort through competing claims and products.

• Block Diagram
• Component Price and Lead-time Trends
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Performance Analysis
• Product Features

AI Semiconductors

The AI coverage area focuses on the AI technology and how it impacts semiconductor market. The forecasts include market size for various domains, including Data Centers, Cloud, PCs, Automotive, and mobile devices. It covers a range of hardware components, such as CPUs, GPUs, ASICs, and FPGAs. Additionally, the coverage offers both qualitative and quantitative insights into the latest trends in the AI market such as generative AI, LLMs, neural network evolution and so on.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data

Advanced CMOS Essentials

Advanced CMOS Essentials focuses on leading-edge SoCs and the technology used to manufacture them through structural and materials analysis. It identifies differences or nuances between competing technologies and differences between process technology options from the same company. Process Analytics offers aggregated process data, helping you create visualizations and trends of company, product, and technology evolution.

• Competitor Analysis
• Data Visualisation
• Inquiry Privileges
• Insight Reports
• Process

Compute Semiconductors

The Compute coverage area delivers market share data and forecast analysis, encompassing cloud infrastructure, client computing, and embedded computing. The cloud computing segment includes microprocessors, accelerators, FPGAs and captive market ASICs. The client computing segment comprises CPUs, APUs, ASICs, and GPUs. The embedded computing segment includes MPUs, MCUs, FPGAs, DSPs, and GPUs. All these categories provide comprehensive coverage of AI processors and accelerators within their respective segments.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data

Data Center / Cloud Semiconductors

The Data Center / Cloud coverage area offers an integrated perspective on the essential components of global data centers for the upcoming five years, encompassing memory, storage solutions, CPUs, AI/GPU accelerators, and server infrastructure. This comprehensive analysis spans both private data centers and public cloud environments. It features a comparative evaluation of top public cloud providers, projecting service hours and hardware requisites. Additionally, the report includes an assessment of hardware market shares, highlighting dominant manufacturers in server, CPU, and accelerators.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data

Digital Floorplan

Digital Floorplan is a high-level view of SoC design quality, focusing on leading-edge APU, CPU, GPU, AI accelerator, FPGA, baseband / connectivity, VPU, advanced MCU components, plus emerging applications such as AR and vision processing SoCs.

• Competitor Analysis
• Data Visualisation
• IC Floorplan
• Inquiry Privileges
• Insight Reports

Microprocessor Report

Microprocessor Report is an industry-leading weekly journal covering new Microprocessors and SoCs, providing insight into their target application and market, and differentiation from their competitive products. This will expand your access to more of the information you need to compete globally and enhance your ability to make fact-based decisions that will impact your business faster and more effectively.

• EE Component Usage Across Products
• High Resolution Images
• IC Floorplan
• Inquiry Privileges
• Insight Reports
• Packaging
• Performance Analysis
• Process
• Product Features

Advanced Packaging

Advanced Packaging coverage helps you understand all aspects of advanced logic technologies, gain visibility into the competition’s historical – and anticipated – approach, and make better next-node technology choices.

• Competitor Analysis
• Data Visualisation
• Inquiry Privileges
• Insight Reports
• Packaging

Process Flow Analysis

Process Flow Analysis provides and tabulates a listing of process steps for a better understanding of how a chip is manufactured to help identify areas for process optimization.

• Competitor Analysis
• Data Visualisation
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Process Flow

SoC Design Analysis

SoC Design Analysis concentrates on high-volume, first-to-market SoCs from top fabless and foundry partnerships and offers standard cell circuit extraction and layout analysis on key areas of cutting-edge SoCs. It gives insights on area and routing trade-offs and informs future design library choices. TechInsights' SoC Design analytics enable querying data, trend analysis, comparisons, and visualizations within Logic.

• Circuit
• Competitor Analysis
• Data Visualisation
• Inquiry Privileges
• Insight Reports

SoC Markets

SoC Markets provides projections for IP licensing, royalty, and service revenues across various IP categories such as Memory, CPU, DSP, Graphics, Interconnect, Security, among others. Additionally, it offers insights into design initiations spanning PC/Servers, Communications, Consumer Electronics, Industrial, and Transportation sectors. A particular focus is given to the new fields of AI and RISC-V SoCs. The analysis also presents an overview of SoC silicon and software design costs across process nodes.

• Block Diagram
• Competitor Analysis
• Cost Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis
• Product Features

Transistor Architecture Comparison

Transistor Architecture Comparison coverage provides insight into the front end of line (FEOL) innovation that drives the world's most advanced technology solutions and how industry leaders deployed them (TSMC, Samsung, Intel) over the last three generations.

• Competitor Analysis
• Data Visualisation
• Inquiry Privileges
• Insight Reports
• Transistor Comparison

Transistor Characterization

The Transistor Characterization assists in seeing the complete picture of process technologies and DC performance (Transistor Characterization). Understand the process, see the benchmark, and spot the trends. Transistor Characterization and Process Analytics assists you in conducting trend and predictive analysis of process data and its impact on transistor characterization (DC) performance through customized visualizations.

• Competitor Analysis
• Data Visualisation
• Inquiry Privileges
• Insight Reports
• Performance Analysis

CMRS Equipment Database

CMRS Equipment Database covers market shares with annual and quarterly forecasts for these segments along with equipment demand by device type and region.

• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Market Data​

CMRS Forecast Pro

CMRS Forecast Pro provides critical datasets for semiconductors, silicon, packaging, designs and reticles along with semiconductor inventories, capacity and supply-demand analysis.

• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Market Data​

CMRS More than Moore

CMRS More than Moore analysis focuses on equipment markets for greater than 28nm semiconductor manufacturing. Typical segments include LED, MEMs, power, and compound semiconductors.

• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Market Data​

CSS Premium

CSS Premium includes market intelligence data focused specifically on subsystems and components used in semiconductor and related capital equipment.

• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Market Data​

CSUBs Driving Forces

Essential data for assessing current market status, forecasting, and building dashboards.

• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Market Data​

CSUBs Supplier Shares

Market share and forecast data for critical subsystem and components as well as equipment and chamber unit demand.

• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Market Data​

CSUBs Critical Components

CSUBs Critical Components includes market shares and forecast data for critical components as well as additional analysis for applications, consumption by equipment type or by OEMs and fabs​.

• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Market Data​

TST Device Interface Board Report

TST Device Interface Board Report provides market sizing and share databases, forecasts, regional and application sales​ for DIB providers.

• Block Diagram
• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• High Resolution Images
• Inquiry Privileges
• Market Data​

TST Probe Card Report

TST Probe Card Report provides market sizing and share databases, forecasts, and regional and application sales​ for providers.

• Block Diagram
• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• High Resolution Images
• Inquiry Privileges
• Market Data​

TST Test Burn-In Socket Report

TST Burn-In Socket Report provides market sizing and share databases, forecasts, regional and application sales​ for providers.

• Block Diagram
• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• High Resolution Images
• Inquiry Privileges
• Market Data​

Process​

Advanced Memory Process analysis provides an overview of chip technology, critical features, and dimensions. It provides analyst insights into technical trends and roadmaps, design technology interaction analyses, detailed explanations of process integrations, and next node predictions.

• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Process

DRAM Circuit Analysis

Highlights circuit innovation by providing full, transistor-level analysis on leading-edge DRAM memory circuits. TechInsights’ circuit analysis allows you to study the latest design trends and discover design elements that can help drive efficiency in your manufacturing process.

• Block Diagram
• Circuit
• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports

DRAM Floorplan​

In more complex semiconductor chips, different functional blocks and the pathways that connect them are arranged for maximum efficiency and best physical fit. DRAM Floorplan analysis identifies the functional blocks, their purpose, their technology generation, and their relative cost to produce. It explores the placement of different functional blocks and resulting changes in performance.

• Competitor Analysis
• High Resolution Images
• IC Floorplan
• Inquiry Privileges
• Insight Reports

DRAM Peripheral Design

NAND Peripheral Design focuses on the circuit schematic design of critical NAND device metrics for a better understanding of peripheral design, functionality, structure, and layout to help accelerate R&D and fast-track the design learning curve.

• Circuit
• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports

DRAM SWD and SA Transistor Characterization

Provides cross-technology and trend analysis as well as information on the performance of transistors used in DRAM through transistor characteristic analysis. Professionals from foundries, IDMs, and fabless organizations use this analysis to benchmark against competitors and to see how process differences impact performance between technologies.

• Block Diagram
• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Performance Analysis
• Transistor Comparison

Embedded and Emerging Functional and Process Analysis​

Embedded and Emerging Functional and Process Analysis is focused on enabling understanding of all process aspects of embedded and emerging memory through dimensional, materials, architecture analysis. It also provides analyst perspectives on the above to provide insight into trends and roadmaps. Analysis may include SEM cross-sectional and bevel imaging, TEM cross-sectional with TEM EDS, technical trend/roadmap by technology element, interaction analysis, detailed explanation of process integrations and/or next node predictions.

• Competitor Analysis
• High Resolution Images
• IC Floorplan
• Inquiry Privileges
• Insight Reports
• Process

Embedded and Emerging Process Flow​

Embedded and Emerging Process Flow provides insight into the manufacturing process steps, materials, and technology across leading edge embedded and emerging memory chips to help identify areas for process optimization.

• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Process Flow

Memory Semiconductors

The Memory coverage area provides a comprehensive analysis of the NAND and DRAM markets, covering key aspects such as supply and demand dynamics across various segments including PC, datacenter, mobile, automotive (DRAM) and SSDs, eMMC and UFS (NAND). It meticulously maps the market landscape, offering insights into production volumes, pricing trends, technological advancements, and market shares. The report highlights the factors influencing memory supply, such as manufacturing capacities and capacity utilization, and delves into demand fluctuations driven by consumer electronics cycles, enterprise IT investments, AI and automotive industry requirements.

• Competitor Analysis
• Data Visualization
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data

NAND Circuit Analysis​

Highlights circuit innovation by providing full, transistor-level analysis on leading-edge NAND memory circuits. TechInsights’ circuit analysis allows you to study the latest design trends and discover design elements that can help drive efficiency in your manufacturing process.

• Block Diagram
• Circuit
• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports

NAND Internal Waveform Overview​

NAND Internal Waveform Analysis captures the specific steps, pulses, and amplitudes on select pins during program, read, and erase cycles of one flash die of a package. The content provides an innovative, cost-effective approach to delivering a subset of a waveform analysis report.

• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Systems

NAND Floorplan​

In more complex semiconductor chips, different functional blocks and the pathways that connect them are arranged for maximum efficiency and best physical fit. Floorplan analysis identifies the functional blocks, their purpose, their technology generation, and their relative cost to produce. It explores the placement of different functional blocks and resulting changes in performance.

• Competitor Analysis
• High Resolution Images
• IC Floorplan
• Inquiry Privileges
• Insight Reports

NAND Transistor Characterization​

NAND Transistor Characterization provides cross-technology analysis and information on the performance of transistors used in NAND devices through transistor characteristic analysis. It provides key information on competition and vendor performance with unbiased third-party data.

• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Performance Analysis
• Transistor Comparison

Process Flow Analysis​

Process Flow Analysis provides and tabulates a listing of process steps for a better understanding of how a chip is manufactured to help identify areas for process optimization.

• Competitor Analysis
• Data Visualisation
• High Resolution Images
• Inquiry Privileges
• Insight Reports
• Process Flow

SSD Teardown​

SSD Teardown represents a sampling of industry leaders in the SSD space. Uncover the driving forces behind density increases and cost reductions. Sample manufacturers include: Samsung, Micron, Intel, SK hynix, SanDisk, Toshiba.

• Block Diagram
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Acoustic Wave Filter

Provides more insight into filter design strategies and their integration in RF front end (RFFE) SiPs to support evolving 5G demands and requirements. This content includes structural, materials, and topographical analyses of acoustic filters from highly integrated 5G RF Front End Modules and System-in-Packages (SiPs).

• Block Diagram
• Competitor Analysis​
• High Resolution Images
• Inquiry Privileges
• Insight Reports​
• Process

Front End Die Circuit

Reveals how leading manufacturers are addressing space and power challenges in RF power amplifiers (PAs), low noise amplifiers (LNAs) and RF switches found on current RF Front End Modules. Extends the analysis from the Front End Module Architecture content to reveal more detailed insight at the circuit level.

• Block Diagram
• Circuit
• Competitor Analysis​
• High Resolution Images
• Inquiry Privileges
• Insight Reports​
• Product Features

Front End Module Architecture

Provides more insight on how leading manufacturers are shifting away from discrete components to more space efficient solutions like power amplifier modules (PAM) and transceiver antenna modules. Shows interconnectivity of the die, filters and components from highly integrated RF Front End Modules (FEMs) found on cutting-edge designs from the latest 5G handsets.

• Block Diagram
• Circuit
• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports

Front End Power Management Architecture​

Enables a better comparison and understanding of how design constraints for power supply management are addressed. Includes and builds on the Front End Power Management Floorplan content to provide detailed block level architecture of envelope/average power trackers and FR2 PMICs.

• Circuit
• Competitor Analysis
• Inquiry Privileges
• Insight Reports

Front End Power Management Floorplan

Focuses on power supply management, which is a key design challenge for RF Front End systems within market leading 5G handsets. Provides insight into competitive designs including high level block identification, high level process data and manufacturing costs for envelope/average power trackers and FR2 PMICs from recent 5G smartphone platforms and wearables.

• Block Diagram
• Circuit
• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Insight Reports

IoT Teardowns

With increasing focus on edge computing, industrial IoT, and AI, IoT modules are a key component in enabling the intercommunication of devices through the internet. TechInsights' IoT Teardowns uncover technical innovations in IoT Modules in cutting edge consumer electronics to reveal key competitive insights on market leaders. Sample manufacturers include: Gemalto, Google, Arduino, Nvidia.

• Block Diagram
• Competitor Analysis
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

Mobile RF Architecture​

Provides the most detailed RF front end block diagrams (from the antennae to the RF transceiver) for flagship 5G handsets in the industry for an in-depth understanding of RF front end design. There is no black boxing, and the reports include all passives in the system, antenna tuners, filters, FEM high-level layout, pin ins/pin outs, circuit board delayering, and cross-probing between the schematic and the layout of the physical printed circuit board (PCB).

• Block Diagram
• Competitor Analysis
• Inquiry Privileges
• Insight Reports

Mobile Semiconductors

The Mobile coverage area provides a comprehensive analysis of semiconductor consumption by leading mobile device manufacturers. It integrates this data with market share insights from key players in the application processor and baseband semiconductor landscape. The analysis is further enriched with detailed coverage of AI-capable application processors, as well as Apple’s A-series and M-series chips.

• Competitor Analysis
• Data Visualization
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data

Mobile Teardowns

Mobile Teardowns include smartphones and tablets as well as a wide selection of devices from a variety of major geographical centers. Sample manufacturers include: Apple, HTC, Huawei, Samsung, Xiaomi, Lenovo, LG, Sony, Nokia, Oppo, Vivo.

• Block Diagram
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

RFIC Packaging​

Enables the comparison of various RFIC advanced packaging implementations to gain a better understanding of how they impact RF system design. This includes aspects such as DC and RF performance pertaining to module packaging, size and thermals, and heterogeneous integration. Analysis includes SEM cross-sectional and EDS materials analyses.

• Block Diagram
• High Resolution Images
• Packaging

RFIC Process

RFIC Process provides structural and materials analysis of transceivers and front end modules from the latest 5G handsets to reveal die structures and materials used during the manufacturing process. It includes topographical imaging and SEM/TEM cross-sectional with EDS/EELS materials analysis of the die structure.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Process

Transceiver Architecture​

Transceiver Architecture enables a better comparison and understanding of how design constraints and challenges are addressed for leading-edge 5G and FR2 transceivers. It includes and builds on the Transceiver Floorplan content to identify key functional blocks and the connections between them.

• Circuit
• Competitor Analysis
• Inquiry Privileges
• Insight Reports

Transceiver Basic Floorplan

Transceiver Basic Floorplan targets the most innovative IoT SoC devices to provide key information on die utilization, block sizes and functionality, die cost and more, to better understand the core functions of the SoC chip.

• Competitor Analysis
• IC Floorplan
• Inquiry Privileges
• Insight Reports

Wearables Teardown

Wearables Teardown covers personal health and fitness wearable systems, smartwatches, virtual reality (VR) headsets, hearables, and action cameras. Sample manufacturers include: Fitbit, Garmin, Samsung, LG, Apple, Huawei, Sony, Xiaomi.

• Block Diagram
• Cost Analysis
• High Resolution Images
• Inquiry Privileges
• Product Features

RF/Analog Semiconductors

The Analog/RF coverage area offers a comprehensive view of various RF Analog markets, providing data on market share, market forecasts, die production forecasts, and financial and product news from various companies in the industry. This product encompasses a wide range of technologies, including specifics on cellular radio components used in cellular user equipment and front-end modules. It also covers Wi-Fi/Ultra-Low Power (ULP) Wi-Fi, Non-Terrestrial Networks (NTN), GaAs, GaN, and SiGe technologies.

• Competitor Analysis
• Data Visualization
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data

PMIC Process Analysis​

PMIC Process Analysis provides in-depth process (structural and materials) analysis of power-management devices based on bipolar-CMOS-DMOS (BCD) technology, integrated voltage regulators (IVR), and other innovative power management devices. It includes analysis of PMICs found in devices in the mobile, automotive, and other industries, and covers structures and materials using SEM, TEM, sMIM/SCM, SEM-EDS, and TEM-EDS/EELS as required. It also includes package and die images and salient features with a comparison summary.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Process

Power Essentials

Power Essentials provides in-depth process analysis for GaN, SiC, and Si power devices, and comprehensive coverage of device metrics and salient features. Analysis includes detailed structural and material analysis using techniques such as SEM, TEM, and SCM/sMIM, covering package and die images/X-rays, SEM planview and cross-sectional images with annotated SEM-EDS material analysis conclusions, and cross-sectional TEM images with annotated TEM-EDS/EELS analysis conclusions for GaN devices, cross-sectional and planar SCM (sMIM) analysis for Si and SiC.

• Competitor Analysis
• Inquiry Privileges
• Insight Reports
• Process

Power Semiconductors

The Power coverage area includes the market share of leading vendors, along with market forecasts segmented by technology (GaN, Si, SiC), device type, end-market application, and region. The device types considered in this coverage include power ICs, power discretes, and power modules.

• Competitor Analysis
• Data Visualization
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data

Silicon Carbide (SiC) & Gallium Nitride (GaN) Process Flow

Silicon Carbide (SiC) & Gallium Nitride (GaN) Process Flow provides in-depth process flow analysis detailing the manufacturing steps to fabricate innovative SiC power devices from wafer-in to wafer-out. Analysis includes process architecture, mask list, and integration-level process steps, layout (.GDS) decomposed into process layers, and emulated device structure, tool type as well as design rules, layer dimensions, and process assumptions.

• Block Diagram
• Competitor Analysis
• High Resolution Images
• Inquiry Privileges
• Process Flow

Chip Insider

The Chip Insider is a go-to resource for senior semiconductor executives. It provides straightforward reports on current industry issues, trends, strategies, and tactics. Get insider insights on supplier-customer dynamics, corporate strategies, industry trends, challenges, projections, and historical facts, presented in a clear and informative manner.  

• Inquiry Privileges
• Insight Reports

McClean Report

The McClean Report helps you identify how to better position your business to be competitive. You don’t have to be an expert in semiconductors to understand the broad variety of analyses and perspectives, and how The McClean Report can complement your business, and your business decision-making – not only from the technical or legal point of view but also from the geopolitical, and regional market(s) angle.

• Inquiry Privileges
• Insight Reports

Microprocessor Report

Microprocessor Report is an industry-leading weekly journal covering new Microprocessors and SoCs, providing insight into their target application and market, and differentiation from their competitive products. This will expand your access to more of the information you need to compete globally and enhance your ability to make fact-based decisions that will impact your business faster and more effectively.

• Block Diagram
• Component Price and Lead-time Trends
• Competitor Analysis
• EE Component Usage Across Products
• High Resolution Images
• IC Floorplan
• Inquiry Privileges
• Insight Reports
• Packaging
• Performance Analysis
• Process
• Product Features

Semiconductor Analytics

Semiconductor Analytics provides weekly data visualization on semiconductor supply and demand analysis, and provides granular level sales per week and allows for quarterly and yearly comparisons.

• Competitor Analysis
• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Insight Reports
• Market Data
• Supply Analysis

TCI Graphics

TCI Graphics content provides a unique view into the health of the semiconductor manufacturing ecosystem, including key performance indicators across electronics, semiconductor, and equipment supply chains with simple charts to communicate changes in the market with weekly and monthly views.

• Data Visualisation
• Demand Forecasts
• Inquiry Privileges
• Market Data
• Supply Analysis