Featured Report Analysis
Summary - BIWIN Mini SSD 1 TB Deep Dive Teardown
Discover the BIWIN Mini SSD, an ultra-compact PCIe 4.0 x2 NVMe device analyzed in our Deep Dive teardown with detailed construction, benchmarking, and cost insights.
Global Handset vendor share Q3 2025
Global handset shipments were nearly flat in Q3 2025, with six top vendors showing annual growth. The report includes market share data for 30 vendors by region.
Honor’s Q3 2025 Growth Fueled by Mid-Tier Sales
Honor experienced double-digit YoY smartphone shipment growth in Q3 2025 due to overseas expansion, but faced declining wholesale ASP and revenue challenges.
Advanced Packaging - Smartphone Processors
Smartphone APUs integrate CPU, GPU, and modems, with innovations in packaging like PoP and fan-out addressing heat, space, and durability challenges.
Industry Performance (TCI Graphics) – November 21, 2025
Discover how surging prices and low supplies impact AI infrastructure demand. Access weekly, monthly, and yearly data to enhance supply chain management.
2025 Q4 Advanced Driver Assistance Systems 2023-2032
The ADAS market is shifting from dedicated systems to centralized platforms, presenting new challenges and opportunities for suppliers.
Company Earnings – Q3 2025 (Q3 FY 2026) NVIDIA
Explore key insights from Nvidia's quarterly earnings call, covering revenue, profit, inventory, and market commentary on demand and supply trends.
OECD Fixed Broadband Price Benchmarking Q3 2025
Explore the Q3 2025 OECD Fixed Broadband Price Benchmarking update, featuring 1,500+ tariff plans from 120 providers across 38 countries.
AMD Ryzen 9 7950X3D Advanced Packaging Process Flow Analysis
Dive into TSMC’s SoIC 3D integration with our analysis of the hybrid-bonded SoIC-X process in AMD’s 7950X3D, outlining key packaging steps and critical dimensions.
Summary - Apple iPhone Air A3517 Survey Plus Teardown
Explore the iPhone Air A3517 with our Survey Plus report, covering its A19 Pro design, new N1 and C1X chips, and core IC, RF, and subsystem insights.
Narrative: Smartphone Image Sensor Market Share Q3 2025
Uncover Q3 2025 smartphone image sensor trends, from rising ASPs and high-end demand to shifting vendor shares led by Sony, Samsung, and OMNIVISION.
Summary - Apple iPhone Air A3260 Deep Dive Teardown
Discover the thinnest iPhone 17 with our Deep Dive teardown of the iPhone Air, uncovering its A19 Pro design, new N1 and C1X chips, and key construction and cost insights.
Analysis: E-Axle Modules Developments 2025
Drive deeper into the latest e-axle advances, from higher motor–inverter–transmission integration to industry efforts to cut rare-earth use and strengthen material supply options.
Summary - Micron 2500 (MTFDKBA1T0QGN) Deep Dive Teardown
Explore the Micron 2500 NVMe SSD—the first client drive with 200+ layer QLC NAND—with key design, construction, and cost insights from our Deep Dive teardown.
Apple iPhone 17 Pro A3523 Survey Plus Teardown
The Apple iPhone 17 Pro A3523 Europe features the A19 Pro chip, detailed component analysis, RF modules, and sub-assembly insights for a premium mobile experience.
Dimensity 9500 Debuts Arm C1 Cores and Dual-NPU
MediaTek's Dimensity 9500, built on TSMC's N3P, features an all big core CPU, advanced GPU, and 100 TOPS AI capabilities, leading in performance benchmarks.
OECD Mobile Voice and Data Price Benchmarking Q3 2025
The OECD Q3 2025 update offers insights on mobile voice and data pricing from 76 providers across 38 countries, featuring 2,300 tariff plans for analysis.
Global 5G Smartphone Vendor Share by Region Q3 2025
Global 5G smartphone shipments grew in Q3 2025, with Asia Pacific leading. While mature markets slow, emerging regions and Chinese brands surge.